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FGH20N60UFDTU

Onsemi

FGH20N60UFDTU by Onsemi

FGH20N60UFDTU by Onsemi is an N-CHANNEL IGBT with a max collector-emitter voltage of 600V and a max gate-emitter voltage of 20V. It has a nominal turn-off time of 155ns, making it ideal for power control applications requiring fast switching speeds. The transistor's package style is flange mount with a max power dissipation of 165W, suitable for high-power operations.

Median Price

$1.452

Lifecycle Status

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6

In-Stock Inventory

1k+

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Rochester

USA . 349 parts In-Stock

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$1.290

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$1.160

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$1.090

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$1.090

Verical

USA . 248 parts In-Stock

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$1.613

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Digiode

USA . 1,898 parts In-Stock

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$1.378

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Vyrian

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Chip Stock

USA . 4,934 parts In-Stock

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ComSIT Distribution GmbH

Germany . 2,155 parts In-Stock

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Corohmni

South Africa . 21 parts In-Stock

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$0.861

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Advanced Electronics

New Zealand . 97 parts In-Stock

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$1.180

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$1.074

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$0.968

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Corphita

USA . 977 parts In-Stock

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$1.305

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Northwest PG Solutions

USA . 1,984 parts In-Stock

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$3.480

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RC Electronics

USA . 31,541 parts In-Stock

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$2.180

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$1.990

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$1.930

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Perfect Parts

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SupplyDigital Components

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A-Z Elektronik GmbH

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Alle Elektronik GmbH

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Problanco Electronics

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TANS Electronics

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Kulean Microsystems

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Kepictronics

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Infinite Electronics LLP (Excess)

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Assy Fe

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Native Components

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UHIMA Technologies

Türkiye . 201 parts In-Stock

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Microchip USA

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Overview

Unleash the power of the FGH20N60UFDTU by Onsemi, a top-of-the-line Insulated Gate Bipolar Transistor specifically designed for power control applications. With a single configuration and built-in diode, this transistor offers unrivaled performance and reliability. Manufactured by Onsemi, a trusted name in semiconductor technology, the FGH20N60UFDTU guarantees quality and precision. Whether you're looking to maximize power dissipation or optimize efficiency, this product delivers on all fronts. Trust Onsemi's expertise and elevate your projects with the FGH20N60UFDTU.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Polarity or Channel Type: N-CHANNEL

Enhances efficiency and performance in power control applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies circuit design and saves space by incorporating a diode within the transistor package.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, ensuring reliable and efficient operation.

Package Shape: RECTANGULAR

Allows for easy integration into various circuit designs and layouts.

Maximum Power Dissipation (Abs): 165 W

Capable of handling high power levels, making it suitable for demanding applications.

Maximum Gate-Emitter Voltage: 20 V

Provides a high level of gate control voltage, ensuring precise switching and performance.

Maximum Collector Current (IC): 40 A

Can handle high current levels, making it suitable for power control applications.

Maximum Collector-Emitter Voltage: 600 V

Supports high voltage requirements, making it suitable for a wide range of applications.

Nominal Turn On Time (ton): 29 ns

Fast turn on time enhances efficiency and response in power control applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FGH20N60UFDTU attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Additional Features:

LOW CONDUCTION LOSS

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Maximum Fall Time (tf):

64 ns

Maximum Gate-Emitter Threshold Voltage:

6.5 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

155 ns

Nominal Turn On Time (ton):

29 ns

Trade Compliance

FGH20N60UFDTU Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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