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FGH25N120FTDS

Onsemi

FGH25N120FTDS by Onsemi

FGH25N120FTDS by Onsemi is an N-CHANNEL IGBT with 1200V max collector-emitter voltage, 50A max collector current, and 313W max power dissipation. Ideal for power control applications, it features a single configuration with built-in diode and operates at a max temperature of 150 °C.

Median Price

$5.130

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 589 parts In-Stock

1+ parts

-

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$5.130

1k+ parts

$4.590

10k+ parts

$4.320

589

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$5.130

$4.590

$4.320

Distributors (In-Stock)

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Digiode

USA . 2,672 parts In-Stock

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$5.415

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2,672

$5.415

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Vyrian

USA . 7,736 parts In-Stock

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ComSIT Distribution GmbH

Germany . 21 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 503 parts In-Stock

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$1.167

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-

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503

$1.167

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Advanced Electronics

New Zealand . 40 parts In-Stock

1+ parts

$1.349

100+ parts

$1.228

1k+ parts

$1.106

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-

40

$1.349

$1.228

$1.106

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Corphita

USA . 810 parts In-Stock

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$5.130

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810

$5.130

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Perfect Parts

USA . 24,192 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 21,510 parts In-Stock

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A-Z Elektronik GmbH

Germany . 9,894 parts In-Stock

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Kulean Microsystems

USA . 6,875 parts In-Stock

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Problanco Electronics

Mexico . 6,471 parts In-Stock

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SupplyDigital Components

Austria . 5,790 parts In-Stock

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TANS Electronics

Latvia . 2,320 parts In-Stock

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Northwest PG Solutions

USA . 1,579 parts In-Stock

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Alle Elektronik GmbH

Germany . 1,076 parts In-Stock

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Metaverse IC Inc.

Canada . 1,000 parts In-Stock

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Supply Digital

USA . 933 parts In-Stock

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UHIMA Technologies

Türkiye . 617 parts In-Stock

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617

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Native Components

USA . 605 parts In-Stock

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605

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Kepictronics

USA . 450 parts In-Stock

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Overview

Enhance your power control applications with the FGH25N120FTDS IGBT by Onsemi. Manufactured with precision and quality in mind, this N-CHANNEL transistor offers a single configuration with a built-in diode, providing reliable and efficient performance. With a maximum collector-emitter voltage of 1200V and a maximum power dissipation of 313W, this transistor is designed to handle high-power applications with ease. Trust in Onsemi's expertise in semiconductor technology and elevate your projects with the FGH25N120FTDS IGBT.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and protection for the internal components of the IGBT.

Configuration: SINGLE WITH BUILT-IN DIODE

Convenience of having a built-in diode simplifies circuit design and saves space.

Nominal Turn Off Time (toff): 299 ns

Fast turn off time allows for efficient power control and responsiveness in switching applications.

Maximum Power Dissipation (Abs): 313 W

High power dissipation capability makes this IGBT suitable for high-power applications.

Maximum Collector-Emitter Voltage: 1200 V

Can handle high voltages, making it suitable for a wide range of power control applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FGH25N120FTDS attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

Maximum Fall Time (tf):

132 ns

Maximum Gate-Emitter Threshold Voltage:

7.5 V

Maximum Gate-Emitter Voltage:

25 V

JEDEC-95 Code:

TO-247AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Maximum Rise Time (tr):

53 ns

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

299 ns

Nominal Turn On Time (ton):

63 ns

Trade Compliance

FGH25N120FTDS Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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