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FGH25T120SMD-F155

Onsemi

FGH25T120SMD-F155 by Onsemi

FGH25T120SMD-F155 by Onsemi is an N-CHANNEL IGBT with 1200V max collector-emitter voltage, 50A max collector current, and 428W max power dissipation. Ideal for power control applications, it features a single configuration with built-in diode and through-hole terminals.

Median Price

$3.230

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

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Avnet

USA . 210 parts In-Stock

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Future Electronics

Canada . 200 parts In-Stock

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$3.230

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$3.180

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$3.230

$3.180

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Nova Conductors

Japan . 98 parts In-Stock

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$4.375

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$4.375

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Vyrian

USA . 2,630 parts In-Stock

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Digiode

USA . 1,922 parts In-Stock

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IBS Electronics

USA . 200 parts In-Stock

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$4.460

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$4.460

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NAC Semi

USA . 150 parts In-Stock

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$5.380

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$4.970

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$4.970

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Distributors (Availability)

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Corohmni

South Africa . 707 parts In-Stock

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$4.202

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707

$4.202

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Continental Prestige Electronics

USA . 6,911 parts In-Stock

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$4.375

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$4.288

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$4.375

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$4.288

Argo Parts USA

USA . 2,451 parts In-Stock

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$4.375

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$4.375

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AZTECH Wire

Italy . 951 parts In-Stock

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$12.827

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$12.827

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Microchip USA

USA . 6,247 parts In-Stock

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$21.168

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Ampacity Inc.

Singapore . 223 parts In-Stock

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$22.050

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Perfect Parts

USA . 301,888 parts In-Stock

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Lixinc

USA . 14,536 parts In-Stock

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TANS Electronics

Latvia . 13,969 parts In-Stock

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SupplyDigital Components

Austria . 11,310 parts In-Stock

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Problanco Electronics

Mexico . 9,916 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 8,716 parts In-Stock

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Kulean Microsystems

USA . 7,014 parts In-Stock

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Kepictronics

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Corphita

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UHIMA Technologies

Türkiye . 1,430 parts In-Stock

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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RC Electronics

USA . 450 parts In-Stock

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GreenTree Electronics

Israel . 450 parts In-Stock

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Metaverse IC Inc.

Canada . 400 parts In-Stock

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Supply Digital

USA . 285 parts In-Stock

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Netroflash

USA . 150 parts In-Stock

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$4.288

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$4.156

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$4.069

150

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$4.156

$4.069

Overview

Enhance the power and efficiency of your electronic devices with the FGH25T120SMD-F155 insulated gate bipolar transistor by Onsemi. Designed with high-quality materials and advanced technology, this N-CHANNEL transistor is ideal for power control applications, offering reliability and performance like no other. With a maximum collector-emitter voltage of 1200V and a maximum gate-emitter voltage of 25V, this transistor can handle heavy loads with ease. Upgrade your systems today with the FGH25T120SMD-F155 and experience the difference in power and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides insulation and protection for the internal components, ensuring durability and reliability.

Polarity or Channel Type: N-CHANNEL

N-Channel IGBTs typically have better performance characteristics, making this product suitable for power control applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Built-in diode simplifies circuit design and can improve efficiency in certain applications.

Transistor Application: POWER CONTROL

Specifically designed for power control applications, ensuring optimal performance in such scenarios.

Maximum Power Dissipation (Abs): 428 W

Capable of handling high power levels, making it suitable for demanding applications.

Maximum Operating Temperature: 175 °C

Can operate at high temperatures without compromising performance, ensuring reliability in various environments.

Maximum Collector-Emitter Voltage: 1200 V

Capable of handling high voltage levels, making it suitable for high-power applications.

Maximum Collector Current (IC): 50 A

Capable of handling high current levels, making it suitable for power control applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FGH25T120SMD-F155 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

Maximum Gate-Emitter Threshold Voltage:

7.5 V

Maximum Gate-Emitter Voltage:

25 V

JEDEC-95 Code:

TO-247AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

584 ns

Nominal Turn On Time (ton):

88 ns

Trade Compliance

FGH25T120SMD-F155 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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