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FGH20N60SFDTU

Onsemi

FGH20N60SFDTU by Onsemi

FGH20N60SFDTU by Onsemi is an N-CHANNEL IGBT transistor with a max collector-emitter voltage of 600V and a max gate-emitter voltage of 20V. It has a nominal turn-off time of 123ns, making it suitable for power control applications requiring fast switching speeds. With a max power dissipation of 165W, this transistor is ideal for high-power applications in industrial settings.

Median Price

$3.660

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 17 parts In-Stock

1+ parts

$1.900

100+ parts

$1.790

1k+ parts

$1.620

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17

$1.900

$1.790

$1.620

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Mouser Electronics

USA . 2 parts In-Stock

1+ parts

$3.660

100+ parts

$2.310

1k+ parts

$1.960

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2

$3.660

$2.310

$1.960

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DigiKey

USA . 103 parts In-Stock

1+ parts

$3.670

100+ parts

$2.904

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-

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103

$3.670

$2.904

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EBV Elektronik

Germany . 90 parts In-Stock

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90

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Distributors (In-Stock)

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Digiode

USA . 2,609 parts In-Stock

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$1.805

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2,609

$1.805

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Nova Conductors

Japan . 600 parts In-Stock

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$2.023

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600

$2.023

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TME

Poland . 282 parts In-Stock

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$2.470

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$1.760

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282

$2.470

$1.760

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Vyrian

USA . 7,216 parts In-Stock

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Flip Electronics

USA . 1,890 parts In-Stock

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1,890

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Micros

Poland . 72 parts In-Stock

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$2.560

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72

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$2.560

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Partservice

France . 52 parts In-Stock

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$2.563

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$2.563

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$2.563

52

-

$2.563

$2.563

$2.563

Micros sp.j. W. Kędra i J. Lic

Poland . 32 parts In-Stock

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-

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$3.014

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$3.014

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$3.014

32

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$3.014

$3.014

$3.014

ComSIT Distribution GmbH

Germany . 5 parts In-Stock

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5

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Distributors (Availability)

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Ampacity Inc.

Singapore . 53 parts In-Stock

1+ parts

$1.610

100+ parts

-

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53

$1.610

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Corphita

USA . 2,659 parts In-Stock

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$1.710

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2,659

$1.710

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Corohmni

South Africa . 159 parts In-Stock

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$1.900

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159

$1.900

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Component Stockers USA

USA . 252 parts In-Stock

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$1.950

100+ parts

$2.830

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252

$1.950

$2.830

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Aranea Global

USA . 500 parts In-Stock

1+ parts

$1.983

100+ parts

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$1.903

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500

$1.983

-

$1.903

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Argo Parts USA

USA . 47 parts In-Stock

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$2.023

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-

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47

$2.023

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Continental Prestige Electronics

USA . 584 parts In-Stock

1+ parts

$3.440

100+ parts

$1.630

1k+ parts

$1.560

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584

$3.440

$1.630

$1.560

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AZTECH Wire

Italy . 580 parts In-Stock

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$8.912

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580

$8.912

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Metaverse IC Inc.

Canada . 80,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 29,156 parts In-Stock

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Perfect Parts

USA . 19,886 parts In-Stock

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GreenTree Electronics

Israel . 15,122 parts In-Stock

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Microchip USA

USA . 9,750 parts In-Stock

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Kulean Microsystems

USA . 8,057 parts In-Stock

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Problanco Electronics

Mexico . 6,998 parts In-Stock

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Kepictronics

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A-Z Elektronik GmbH

Germany . 4,569 parts In-Stock

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4,569

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TANS Electronics

Latvia . 4,057 parts In-Stock

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4,057

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Glotronic Ltd.

UK . 3,900 parts In-Stock

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3,900

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Alle Elektronik GmbH

Germany . 3,046 parts In-Stock

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SupplyDigital Components

Austria . 2,166 parts In-Stock

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Supply Digital

USA . 2,166 parts In-Stock

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2,166

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Assy Fe

Spain . 1,000 parts In-Stock

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UHIMA Technologies

Türkiye . 888 parts In-Stock

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888

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Eastek

USA . 390 parts In-Stock

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Authorized Procurement Solutions

USA . 270 parts In-Stock

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270

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Overview

Upgrade your power control systems with the FGH20N60SFDTU by Onsemi. As a leader in Insulated Gate Bipolar Transistors (IGBT), Onsemi delivers top-quality products with single channel configuration and built-in diode for seamless performance. Perfect for applications requiring high power dissipation, this transistor offers reliable operation with a maximum collector-emitter voltage of 600V and maximum gate-emitter voltage of 20V. Trust Onsemi to provide innovative solutions for your power control needs, ensuring efficiency and durability in every use.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, ideal for applications where weight and size are important factors.

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs typically have lower conduction losses and higher power efficiency compared to P-channel IGBTs, making them a good choice for power control applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for easier design implementation and can help protect against reverse currents, enhancing the overall reliability of the system.

Transistor Application: POWER CONTROL

Specifically designed for power control applications, this IGBT is optimized for efficient power switching and control in various systems.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature of 150°C, this IGBT can withstand higher temperatures without compromising performance, suitable for a wide range of industrial applications.

Maximum Collector-Emitter Voltage: 600 V

The high maximum collector-emitter voltage rating of 600 volts allows for handling of higher voltages, making it suitable for power control applications requiring higher voltage levels.

Maximum Collector Current (IC): 40 A

With a high maximum collector current rating of 40 amps, this IGBT can handle large currents, making it suitable for high-power applications that require efficient power control.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FGH20N60SFDTU attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Additional Features:

LOW CONDUCTION LOSS

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Maximum Fall Time (tf):

48 ns

Maximum Gate-Emitter Threshold Voltage:

6.5 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

123 ns

Nominal Turn On Time (ton):

28 ns

Trade Compliance

FGH20N60SFDTU Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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