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FGA3060ADF

Onsemi

FGA3060ADF by Onsemi

FGA3060ADF by Onsemi is an N-CHANNEL IGBT with 600V VCEsat, 2.3V, and 60A IC. Ideal for GENERAL PURPOSE SWITCHING applications, it features a single configuration with built-in diode and a max power dissipation of 176W in a PLASTIC/EPOXY package style.

Median Price

$1.530

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 83 parts In-Stock

1+ parts

$1.461

100+ parts

-

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83

$1.461

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Chip1Stop

Japan . 223 parts In-Stock

1+ parts

$2.320

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223

$2.320

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Mouser Electronics

USA . 131 parts In-Stock

1+ parts

$2.620

100+ parts

$1.830

1k+ parts

$1.750

10k+ parts

$1.720

131

$2.620

$1.830

$1.750

$1.720

DigiKey

USA . 159 parts In-Stock

1+ parts

$3.710

100+ parts

$2.027

1k+ parts

$1.656

10k+ parts

-

159

$3.710

$2.027

$1.656

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Rochester

USA . 3,581 parts In-Stock

1+ parts

-

100+ parts

$1.280

1k+ parts

$1.150

10k+ parts

$1.080

3,581

-

$1.280

$1.150

$1.080

Farnell

UK . 2,231 parts In-Stock

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$1.530

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2,231

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$1.530

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Verical

USA . 1,800 parts In-Stock

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$1.438

10k+ parts

$1.350

1,800

-

-

$1.438

$1.350

Flip Electronics (Authorized)

USA . 900 parts In-Stock

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-

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900

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Distributors (In-Stock)

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Digiode

USA . 847 parts In-Stock

1+ parts

$1.358

100+ parts

-

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847

$1.358

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Nova Conductors

Japan . 97 parts In-Stock

1+ parts

$1.599

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97

$1.599

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Vyrian

USA . 1,044 parts In-Stock

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1,044

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Flip Electronics

USA . 900 parts In-Stock

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900

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,113 parts In-Stock

1+ parts

$1.220

100+ parts

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1,113

$1.220

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Corphita

USA . 986 parts In-Stock

1+ parts

$1.287

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986

$1.287

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Corohmni

South Africa . 58 parts In-Stock

1+ parts

$1.430

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58

$1.430

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Component Stockers USA

USA . 857 parts In-Stock

1+ parts

$1.470

100+ parts

$1.380

1k+ parts

$1.240

10k+ parts

-

857

$1.470

$1.380

$1.240

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Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$1.542

100+ parts

$1.403

1k+ parts

$1.264

10k+ parts

-

500

$1.542

$1.403

$1.264

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Continental Prestige Electronics

USA . 3,552 parts In-Stock

1+ parts

$1.574

100+ parts

-

1k+ parts

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10k+ parts

$1.543

3,552

$1.574

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-

$1.543

Argo Parts USA

USA . 2,915 parts In-Stock

1+ parts

$1.574

100+ parts

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2,915

$1.574

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Bastille Electronics

Australia . 157 parts In-Stock

1+ parts

$1.599

100+ parts

$1.519

1k+ parts

$1.443

10k+ parts

$1.423

157

$1.599

$1.519

$1.443

$1.423

Microchip USA

USA . 3,300 parts In-Stock

1+ parts

$18.720

100+ parts

-

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3,300

$18.720

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Kepictronics

USA . 323,550 parts In-Stock

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323,550

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QUARKTWIN TECHNOLOGY LTD

USA . 22,804 parts In-Stock

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22,804

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SupplyDigital Components

Austria . 6,801 parts In-Stock

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6,801

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TANS Electronics

Latvia . 6,360 parts In-Stock

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Kulean Microsystems

USA . 4,015 parts In-Stock

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Problanco Electronics

Mexico . 3,540 parts In-Stock

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Supply Digital

USA . 2,223 parts In-Stock

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Perfect Parts

USA . 2,007 parts In-Stock

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2,007

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UHIMA Technologies

Türkiye . 765 parts In-Stock

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765

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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500

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GreenTree Electronics

Israel . 448 parts In-Stock

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448

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Metaverse IC Inc.

Canada . 250 parts In-Stock

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250

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Overview

Unleash the power of innovation with the FGA3060ADF by Onsemi, a cutting-edge Insulated Gate Bipolar Transistor designed for superior performance in general purpose switching applications. Manufactured with precision and expertise, this N-CHANNEL transistor boasts a single configuration with a built-in diode, offering customers unmatched reliability and efficiency. With a maximum collector-emitter voltage of 600V and a maximum collector current of 60A, this product delivers exceptional power dissipation and fast turn-on/off times. Elevate your projects with the FGA3060ADF and experience the unparalleled value and benefits it brings to your applications.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protection for the IGBT, ensuring reliable performance in various environments.

Transistor Application: GENERAL PURPOSE SWITCHING

The IGBT is versatile and can be used for a wide range of applications requiring switching functionality, making it a flexible choice for different projects.

Maximum VCEsat: 2.3 V

The low maximum VCEsat value of 2.3 V indicates minimal saturation voltage drop, leading to efficient power usage and reduced heat generation in the IGBT.

Nominal Turn Off Time (toff): 59.2 ns

The fast turn-off time of 59.2 ns ensures quick switching capabilities, allowing for precise control and high-speed operation in applications.

Maximum Power Dissipation (Abs): 176 W

With a high maximum power dissipation of 176 W, this IGBT can handle substantial power levels without risking overheating or performance degradation.

Maximum Collector-Emitter Voltage: 600 V

The high maximum collector-emitter voltage rating of 600 V provides ample voltage tolerance, making this IGBT suitable for applications with varying voltage requirements.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FGA3060ADF attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Maximum Gate-Emitter Threshold Voltage:

7.6 V

Maximum Gate-Emitter Voltage:

20 V

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

GENERAL PURPOSE SWITCHING

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

59.2 ns

Nominal Turn On Time (ton):

40 ns

Maximum VCEsat:

2.3 V

Trade Compliance

FGA3060ADF Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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