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CYIS1SM1000AA-HHCS

Onsemi

CYIS1SM1000AA-HHCS by Onsemi

CYIS1SM1000AA-HHCS by Onsemi is a CMOS image sensor with 1024x1024 pixels, 15x15 um pixel size, and 69 dB dynamic range. It operates at temperatures from 0 to 60 °C and outputs digital voltage in the range of 1-4.25V. Ideal for applications requiring high-resolution imaging with surface mounting feature.

Median Price

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Lifecycle Status

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Digiode

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Vyrian

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TANS Electronics

Latvia . 7,485 parts In-Stock

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Problanco Electronics

Mexico . 2,647 parts In-Stock

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SupplyDigital Components

Austria . 2,439 parts In-Stock

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Kulean Microsystems

USA . 1,979 parts In-Stock

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Corphita

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Native Components

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UHIMA Technologies

Türkiye . 392 parts In-Stock

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Corohmni

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Northwest PG Solutions

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Overview

Capture stunning images with the CYIS1SM1000AA-HHCS image sensor by Onsemi. As a leader in the industry, Onsemi ensures top-notch quality and reliability in all their products. This image sensor is perfect for a wide range of applications, offering exceptional performance and precision. With its advanced technology and innovative design, customers can expect unparalleled value and benefits when using this product. Experience the advantages of high-quality imaging and discover the endless possibilities with the CYIS1SM1000AA-HHCS.

Feature Benefit Bullets

Pixel Size (um): 15X15

The small pixel size allows for higher resolution images to be captured, resulting in clearer and more detailed pictures.

Maximum Supply Voltage: 5 V

The low maximum supply voltage ensures safe operation and compatibility with standard power sources.

Body Width: 29.21 inch

The compact body width makes this sensor suitable for space-constrained applications.

Sensors or Transducers Type: IMAGE SENSOR, CMOS

CMOS image sensors are known for their low power consumption and high-quality image capture, making this a reliable choice for imaging applications.

Body Height: 3.04 mm

The low body height allows for easy integration into various devices or systems.

Package Shape or Style: RECTANGULAR

The rectangular package shape offers versatility in mounting options and integration into different designs.

Maximum Operating Temperature: 60 °C

The high maximum operating temperature ensures the sensor can withstand harsh environmental conditions without compromising performance.

Horizontal Pixel: 1024

The high horizontal pixel count allows for detailed and high-resolution images to be captured.

Output Range: 1-4.25V

The wide output range provides flexibility in signal processing and compatibility with various systems.

Output Type: DIGITAL VOLTAGE

The digital voltage output simplifies signal processing and integration into digital systems.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures the sensor can operate in a wide range of environments.

Housing: CERAMIC

The ceramic housing offers durability and protection for the sensor, making it suitable for long-term use.

Dynamic Range: 69 dB

The high dynamic range allows for capturing both bright and dark areas in a scene with detail and accuracy.

Vertical Pixel: 1024

The high vertical pixel count complements the horizontal pixel count, resulting in detailed and well-balanced images.

Body Length/Diameter: 30.23 mm

The compact body length/diameter makes this sensor easy to integrate and mount in various devices or systems.

Data Rate: 12 Mbps

The high data rate allows for fast and efficient data transfer, crucial for real-time imaging applications.

Termination Type: SOLDER

The solder termination type ensures secure and reliable connections for stable operation.

Frame Rate: 11 fps

The moderate frame rate is suitable for capturing motion in real-time applications without sacrificing image quality.

Array Type: FULL FRAME

The full-frame array type ensures that the entire image sensor area is utilized, resulting in high-quality images with no cropping or loss of data.

Mounting Feature: SURFACE MOUNT

The surface mounting feature makes it easy to solder the sensor onto PCBs or other surfaces for seamless integration into electronic systems.

Technical Specifications

Image Sensors CYIS1SM1000AA-HHCS attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

ELECTRONIC ROLLING SHUTTER

Array Type:

FULL FRAME

Body Width:

29.21 inch

Body Height:

3.04 mm

Body Length/Diameter:

30.23 mm

Data Rate:

12 Mbps

Dynamic Range:

69 dB

Frame Rate:

11 fps

Horizontal Pixel:

1024

Housing:

CERAMIC

Mounting Feature:

Maximum Operating Temperature:

60 Cel

Minimum Operating Temperature:

0 Cel

Output Range:

Output Type:

Package Shape or Style:

Pixel Size (um):

15X15

Sensors or Transducers Type:

Maximum Supply Voltage:

5 V

Termination Type:

SOLDER

Vertical Pixel:

1024

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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