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CYIS1SM1000AA-HHC

Onsemi

CYIS1SM1000AA-HHC by Onsemi

CYIS1SM1000AA-HHC by Onsemi is a CMOS image sensor with 1024x1024 pixels, 15x15 um pixel size, and 69 dB dynamic range. It operates b/w 0-60 °C, outputs digital voltage in the range of 1-4.25V at a data rate of 12 Mbps. Ideal for full-frame applications requiring high-resolution imaging in a compact surface-mount package.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 1,974 parts In-Stock

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Digiode

USA . 557 parts In-Stock

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Native Components

USA . 186 parts In-Stock

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Northwest PG Solutions

USA . 194 parts In-Stock

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Kulean Microsystems

USA . 4,842 parts In-Stock

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Problanco Electronics

Mexico . 3,900 parts In-Stock

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TANS Electronics

Latvia . 3,469 parts In-Stock

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Corphita

USA . 2,340 parts In-Stock

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UHIMA Technologies

Türkiye . 813 parts In-Stock

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SupplyDigital Components

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Corohmni

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Overview

Capture stunning images with the CYIS1SM1000AA-HHC Image Sensor by Onsemi. Known for their exceptional quality and reliability, Onsemi has crafted this sensor to deliver crisp, high-resolution images with a wide dynamic range. Ideal for applications in surveillance, automotive, and industrial cameras, this sensor offers customers unparalleled value and performance. Elevate your imaging projects with the CYIS1SM1000AA-HHC and experience the difference that Onsemi's expertise can make.

Feature Benefit Bullets

Pixel Size (um): 15X15

A small pixel size allows for higher resolution images to be captured with greater detail.

Maximum Supply Voltage: 5 V

Operates within a standard voltage range, making it compatible with a wide range of systems.

Body Width: 29.21 inch

Compact size makes it easy to integrate into various devices and systems.

Sensors or Transducers Type: IMAGE SENSOR,CMOS

CMOS sensors are known for low power consumption and fast readout speeds.

Body Height: 3.04 mm

Low profile design allows for easy incorporation into slim devices.

Package Shape or Style: RECTANGULAR

Rectangular shape enables efficient placement within electronic assemblies.

Maximum Operating Temperature: 60 °C

Wide operating temperature range ensures reliable performance in various environments.

Horizontal Pixel: 1024

High pixel count provides detailed images with sharp clarity.

Output Range: 1-4.25V

Provides a wide output range for flexibility in signal processing.

Output Type: DIGITAL VOLTAGE

Digital output simplifies data transfer and integration with digital systems.

Minimum Operating Temperature: 0 °C

Can operate in cold environments without sacrificing performance.

Terminal Finish: Gold (Au)

Gold terminal finish ensures reliable electrical connections and corrosion resistance.

Housing: CERAMIC

Ceramic housing provides durability and protection for the sensitive components inside.

Dynamic Range: 69 dB

High dynamic range allows for capturing a wide range of light intensities in a single image.

Vertical Pixel: 1024

Equal vertical and horizontal pixel count ensures balanced image resolution.

Body Length/Diameter: 30.23 mm

Compact body size facilitates easy installation and integration into devices.

Data Rate: 12 Mbps

High data rate enables fast and efficient transfer of image data.

Termination Type: SOLDER

Solder termination ensures secure connections for reliable operation.

Frame Rate: 11 fps

Decent frame rate for capturing smooth video footage or fast-moving objects.

Array Type: FULL FRAME

Full frame array ensures that the entire image sensor area is utilized for image capture.

Mounting Feature: SURFACE MOUNT

Surface mount design allows for easy and secure mounting on PCBs or other surfaces.

Technical Specifications

Image Sensors CYIS1SM1000AA-HHC attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

ELECTRONIC ROLLING SHUTTER

Array Type:

FULL FRAME

Body Width:

29.21 inch

Body Height:

3.04 mm

Body Length/Diameter:

30.23 mm

Data Rate:

12 Mbps

Dynamic Range:

69 dB

Frame Rate:

11 fps

Horizontal Pixel:

1024

Housing:

CERAMIC

JESD-609 Code:

e4

Mounting Feature:

Maximum Operating Temperature:

60 Cel

Minimum Operating Temperature:

0 Cel

Output Range:

Output Type:

Package Shape or Style:

Pixel Size (um):

15X15

Sensors or Transducers Type:

Maximum Supply Voltage:

5 V

Terminal Finish:

Gold (Au)

Termination Type:

SOLDER

Vertical Pixel:

1024

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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