Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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CYIS1SM1000AA-HFC by Onsemi is a 15x15 um CMOS image sensor with a max supply voltage of 5V and output range of 1-5V. It has a dynamic range of 72 dB, suitable for applications requiring digital voltage output in a square package style for surface mounting.
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Corohmni
Larger pixel size allows for better light sensitivity and improved image quality, making this image sensor suitable for high-quality imaging applications.
Operating at a maximum supply voltage of 5V provides a reliable and stable power source for the image sensor to function efficiently.
Compact body width of 29.21mm makes this image sensor suitable for applications where space is limited, allowing for easy integration into various devices.
Utilizing CMOS technology enables the image sensor to consume less power, produce less noise, and offer faster readout speeds, making it a versatile and efficient choice for imaging applications.
Low body height of 1.77mm allows for a slim and compact design, making this image sensor suitable for applications where thin form factors are required.
Square package shape ensures easy and secure mounting of the image sensor onto circuit boards, providing stability and reliability in various applications.
With a maximum operating temperature of 60 °C, this image sensor can withstand higher temperatures, making it suitable for applications in environments with elevated heat levels.
Output range of 1-5V provides a wide dynamic range for capturing and processing image data, offering flexibility and precision in image sensing.
Digital voltage output type ensures consistent and reliable signal transmission, enhancing the accuracy and reliability of the captured image data.
Operating at a minimum temperature of 0 °C enables this image sensor to function effectively in cold environments, expanding its usability in various applications.
High dynamic range of 72 dB allows the image sensor to capture a wide range of light intensities accurately, ensuring detailed and high-quality image output.
Compact body length/diameter of 29.21mm ensures easy integration and installation of the image sensor in different devices, simplifying the design process.
Solder termination type ensures secure and reliable connections between the image sensor and other components, providing durability and stability in various applications.
Linear array type allows for the efficient capture and processing of image data in a sequential manner, offering speed and accuracy in image sensing applications.
Surface mounting feature simplifies the installation and assembly of the image sensor on circuit boards, enabling easy and secure integration in various electronic devices.
Image Sensors CYIS1SM1000AA-HFC attributes and parameters. Explore more Image Sensors devices from Onsemi
Additional Features:
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Body Width:
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Dynamic Range:
Mounting Feature:
Maximum Operating Temperature:
Minimum Operating Temperature:
Output Range:
Output Type:
Package Shape or Style:
Pixel Size (um):
Sensors or Transducers Type:
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Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).
President, CEO
Hassane El-Khoury
Executive VP, CFO, Treasurer
Thad Trent
Senior VP
Ross F. Jatou
Aizu Fab
Fabrication
Fab Initiation
1995
Japan
Aizu Wakamatsu
Wafer Capacity
52,000
Si/EPI Fab
2018
Czech Republic
Rožnov pod Radhoštěm
10,000
Expansion Phase 1 for SiC / EPI
2019
14,500
Expansion Phase 2 for SiC / EPI
2024
SiC Fab
2022
USA
Hudson
Bucheon
2013
South Korea
61,000
ISMF - Malaysia
1990
Malaysia
Seremban
95,000
Roznov Device Fab
1987
80,000
Fab 10
2002
East Fishkill
15,000
Burlington
1986
Canada
Gresham
1998
45,000
Bucheon 150mm
2000
50,000
Rochester
1983
Nampa
Pennsylvania
1997
Mountain Top
36,000
LM358N
NXP Semiconductors
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
LL4148
Diodes Incorporated
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
B340A-13-F
SPC TECHNOLOGY/ MULTICOMP
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N7002
Plessey Semiconductors Discrete Components Div
Other Transistors;
LM555CM
Renesas Electronics
Analog Waveform Generation Functions; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
SMBJ18CA
Vishay Intertechnology
Vishay Intertechnology's SMBJ18CA is a bidirectional TRANS VOLTAGE SUPPRESSOR DIODE with a max clamping voltage of 29.2 V and a breakdown voltage of 21.05 V. It is surface mountable and commonly used in transient suppression applications.
SS14
Onsemi
2N2222A
New England Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
LM358M
National Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
Bourns
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Panjit International
1N4148WS
Hitano Enterprise
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BSS138
Fairchild Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Operating Mode: ENHANCEMENT MODE; Qualification: Not Qualified;
M24308/2-1F
Esterline Technologies
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Mounting Option-1: HOLE .115-.125; Mounting Type: CABLE AND PANEL; Mating Contact Finish: NOT SPECIFIED;
STMicroelectronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Maximum Drain Current (ID): .2 A; Transistor Application: SWITCHING;
Semicoa
FDLL4148
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Maximum Feedback Capacitance (Crss): 10 pF; JEDEC-95 Code: TO-236AB;
BAV99
Temic Semiconductors
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
BSS138-7-F
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Drain Current (ID): .2 A; Minimum DS Breakdown Voltage: 50 V; Operating Mode: ENHANCEMENT MODE;
KLI-2113-DAA-ED-AE
KLI-2113-DAA-ED-AE by Onsemi is an image sensor with 14x14 um pixel size, 2098 horizontal and vertical pixels. It operates b/w -25 to 80 °C, with a dynamic range of 76 dB. Ideal for applications requiring high-resolution imaging in industrial automation and surveillance systems.
MT9V032C12STM
Image Sensors;
KAC-00401-CBC-LB-A0
Onsemi's KAC-00401-CBC-LB-A0 Image Sensor features 6.7X6.7um pixel size, 3.3V power supply, and operates b/w -40 to 105 °C. With 768x488 pixels, it is ideal for surface mount applications in various imaging systems.
AR0238CSSC12SPRA0-DR
Onsemi's AR0238CSSC12SPRA0-DR image sensor features 1928x1088 resolution, 3x3 um pixel size, and 96 dB dynamic range. Ideal for applications requiring high-quality digital imaging with a frame rate of 30 fps in a compact square package.
TC276-80
Texas Instruments
TC276-80 by Texas Instruments is an image sensor with 699x288 resolution. Operating at -10 to 45°C, it requires a 12V power supply. Ideal for THROUGH HOLE MOUNT applications in various industries like surveillance and automotive systems.
OV07740-A32A
Omnivision Technologies
IMAGE SENSOR,CMOS;
TC213-50
TC213-50 by Texas Instruments is an image sensor with 12x12 um pixel size, 512 horizontal pixels, and 1000 vertical pixels. Operating at temperatures from -10 to 40 °C, it requires a 12V power supply. Ideal for applications requiring THROUGH HOLE MOUNT feature in various industries.
KAI-47051-AXA-JP-B1
KAI-47051-AXA-JP-B1 by Onsemi is an image sensor with 5.5x5.5 um pixel size, 40 MHz master clock, and 15.5 V max supply voltage. Ideal for applications requiring high-resolution imaging with a dynamic range of 66 dB, such as industrial machine vision systems or scientific cameras.
ASX350AT3C00XPEA0-DP
ASX350AT3C00XPEA0-DP by Onsemi is a 3.75x3.75 um CMOS image sensor with 728H x 560V pixels, offering a dynamic range of 82.2 dB and operating at temperatures from -40 to 105 °C. It features a digital current output interface, suitable for applications requiring high-resolution imaging in industrial automation and surveillance systems.
AS0140AT2C00XUSM0-TRBR
AS0140AT2C00XUSM0-TRBR by Onsemi is a 1/4 inch CMOS image sensor with 1280x800 pixels, 27 MHz master clock, and digital voltage output. It operates b/w -40 to 105 °C, with supply voltage range of 1.7-1.98V. Ideal for frame array applications requiring high-speed data transfer at 60 fps.
KAI-08050-PBA-JD-AE
KAI-08050-PBA-JD-AE by Onsemi is a 5.5x5.5 um CCD image sensor with 3296 (H) x 2472 (V) pixels, offering a dynamic range of 64 dB. This rectangular package sensor in 4/3 inch optical format is ideal for applications requiring high-quality imaging such as industrial machine vision and surveillance systems.
KAC-06040-ABA-JD-BA
The Onsemi KAC-06040-ABA-JD-BA Image Sensor features 4.7x4.7 um pixel size, 50 MHz master clock, and 2832 horizontal pixels. Ideal for applications requiring high-resolution imaging with a max supply voltage of 2.1V and SPI interface output type at a frame rate of 160 fps.
MT9V024IA7XTM-DP
MT9V024IA7XTM-DP by Onsemi features a 6x6 um pixel size, 27 MHz master clock, and 100 dB dynamic range. Ideal for image sensing applications in devices requiring high-resolution imaging capabilities.
KAI-1020-FBA-FD-AE
KAI-1020-FBA-FD-AE by Onsemi is an image sensor with 7.4x7.4 um pixel size, 1000x1000 resolution, and 58 dB dynamic range. It is used in applications requiring high-quality imaging such as surveillance cameras and industrial machine vision systems.
AR0221SR2C00SUEA0-DRBR
The Onsemi AR0221SR2C00SUEA0-DRBR is a 1928x1088 CMOS image sensor with 1/1.7" optical format, offering 60 fps frame rate. It features a 2-WIRE interface and solder termination, suitable for surface mount applications in various imaging systems.
NOIP1SN5000A-QDI
NOIP1SN5000A-QDI by Onsemi is a CMOS image sensor with 2592x2048 pixels, 4.80x4.80 um pixel size, and 72 MHz master clock. It operates at -40 to 85 °C with a dynamic range of 60 dB. Ideal for applications requiring high-resolution imaging at up to 100 fps frame rate.
NOIV1SN025KA-GTI
NOIV1SN025KA-GTI by Onsemi is an image sensor with 4.5x4.5 um pixel size, 310 MHz master clock, and 5120 horizontal pixels. It operates b/w -40 to 85 °C and has a dynamic range of 59.6 dB. Ideal for applications requiring high-resolution imaging at a frame rate of 53 fps in a rectangular package shape with through-hole mounting feature.
CMV4000-3E5C1PP
Ams Ag
CMV4000-3E5C1PP by Ams Ag is a CMOS image sensor with a dynamic range of 60 dB and sensitivity of 5.56 V/lx.s. It operates b/w -30 to 70°C, offers SPI interface, and has a frame rate of 37 fps. Ideal for applications requiring high-quality imaging in varying temperature conditions.
AR0237IRSH12SHRA0-DR-E
The Onsemi AR0237IRSH12SHRA0-DR-E image sensor features 1928x1088 resolution, 3x3 um pixel size, and 96 dB dynamic range. Ideal for applications requiring high-quality imaging such as surveillance cameras, automotive vision systems, and industrial machine vision.
AR0130CSSC00SPBA0-DR
Onsemi's AR0130CSSC00SPBA0-DR is a 1/3 inch CMOS image sensor with 1280x960 pixels, offering a pixel size of 3.75um. It operates at a max supply voltage of 1.95V and has a master clock frequency of 50MHz. Ideal for applications requiring high-resolution imaging in devices such as surveillance cameras and industrial inspection systems due to its compact square package design and digital current output interface.
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CYIS1SM0250AA-HHC
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: RECTANGULAR; Output Range: 1-4.25V; Termination Type: SOLDER;
CYIS1SM0250AA-HHCS
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: RECTANGULAR; Output Range: 1-4.25V; Body Height: 1.178 mm;
CYIS1SM0250AA-WWC
CYIS1SM1000AA-HHC
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: RECTANGULAR; Output Range: 1-4.25V; Dynamic Range: 69 dB;
CYIS1SM1000AA-HHCS
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: RECTANGULAR; Output Range: 1-4.25V; Body Width: 29.21 inch;
CYIS1SM0250AA-C
Infineon Technologies
CYIS1SM0250AA-HFC
CYIS1SM1000AA-HWC
Cypress Semiconductor
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: RECTANGULAR; Output Range: 1-4.25V; Pixel Size (um): 15X15;
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: RECTANGULAR; Output Range: 1-4.25V; Terminal Finish: Gold (Au);
CYIS1SM1000AA-HQC
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: RECTANGULAR; Output Range: 1-4.25V; Maximum Supply Voltage: 5 V;
CYIS1SM1000AA-HFC
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: 1-5V; Body Length/Diameter: 29.21 mm;
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: RECTANGULAR; Output Range: 1-4.25V; Maximum Operating Temperature: 60 Cel;
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