Loading...

CYIS1SM1000AA-HFC

Onsemi

CYIS1SM1000AA-HFC by Onsemi

CYIS1SM1000AA-HFC by Onsemi is a 15x15 um CMOS image sensor with a max supply voltage of 5V and output range of 1-5V. It has a dynamic range of 72 dB, suitable for applications requiring digital voltage output in a square package style for surface mounting.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,198 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,198

-

-

-

-

Vyrian

USA . 512 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

512

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 389 parts In-Stock

1+ parts

$0.554

100+ parts

-

1k+ parts

-

10k+ parts

-

389

$0.554

-

-

-

Northwest PG Solutions

USA . 1,524 parts In-Stock

1+ parts

$0.610

100+ parts

-

1k+ parts

-

10k+ parts

-

1,524

$0.610

-

-

-

Problanco Electronics

Mexico . 2,821 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,821

-

-

-

-

Corphita

USA . 2,131 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,131

-

-

-

-

TANS Electronics

Latvia . 1,928 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,928

-

-

-

-

SupplyDigital Components

Austria . 1,076 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,076

-

-

-

-

UHIMA Technologies

Türkiye . 847 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

847

-

-

-

-

Kulean Microsystems

USA . 771 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

771

-

-

-

-

Corohmni

South Africa . 331 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

331

-

-

-

-

Overview

Elevate your imaging capabilities with the CYIS1SM1000AA-HFC image sensor from Onsemi. Designed with precision and excellence, Onsemi is a trusted manufacturer known for delivering top-quality products in the industry. This image sensor boasts a pixel size of 15x15 um, ensuring exceptional clarity and detail in your images. With a maximum supply voltage of 5V and a dynamic range of 72 dB, this sensor offers unparalleled performance for a wide range of applications. Whether you're in the automotive, security, or medical field, the CYIS1SM1000AA-HFC provides value, reliability, and superior image quality that will take your projects to the next level.

Feature Benefit Bullets

Pixel Size (um): 15X15

Larger pixel size allows for better light sensitivity and improved image quality, making this image sensor suitable for high-quality imaging applications.

Maximum Supply Voltage: 5 V

Operating at a maximum supply voltage of 5V provides a reliable and stable power source for the image sensor to function efficiently.

Body Width: 29.21 inch

Compact body width of 29.21mm makes this image sensor suitable for applications where space is limited, allowing for easy integration into various devices.

Sensors or Transducers Type: IMAGE SENSOR,CMOS

Utilizing CMOS technology enables the image sensor to consume less power, produce less noise, and offer faster readout speeds, making it a versatile and efficient choice for imaging applications.

Body Height: 1.77 mm

Low body height of 1.77mm allows for a slim and compact design, making this image sensor suitable for applications where thin form factors are required.

Package Shape or Style: SQUARE

Square package shape ensures easy and secure mounting of the image sensor onto circuit boards, providing stability and reliability in various applications.

Maximum Operating Temperature: 60 °C

With a maximum operating temperature of 60 °C, this image sensor can withstand higher temperatures, making it suitable for applications in environments with elevated heat levels.

Output Range: 1-5V

Output range of 1-5V provides a wide dynamic range for capturing and processing image data, offering flexibility and precision in image sensing.

Output Type: DIGITAL VOLTAGE

Digital voltage output type ensures consistent and reliable signal transmission, enhancing the accuracy and reliability of the captured image data.

Minimum Operating Temperature: 0 °C

Operating at a minimum temperature of 0 °C enables this image sensor to function effectively in cold environments, expanding its usability in various applications.

Dynamic Range: 72 dB

High dynamic range of 72 dB allows the image sensor to capture a wide range of light intensities accurately, ensuring detailed and high-quality image output.

Body Length/Diameter: 29.21 mm

Compact body length/diameter of 29.21mm ensures easy integration and installation of the image sensor in different devices, simplifying the design process.

Termination Type: SOLDER

Solder termination type ensures secure and reliable connections between the image sensor and other components, providing durability and stability in various applications.

Array Type: LINEAR

Linear array type allows for the efficient capture and processing of image data in a sequential manner, offering speed and accuracy in image sensing applications.

Mounting Feature: SURFACE MOUNT

Surface mounting feature simplifies the installation and assembly of the image sensor on circuit boards, enabling easy and secure integration in various electronic devices.

Technical Specifications

Image Sensors CYIS1SM1000AA-HFC attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

ELECTRONIC ROLLING SHUTTER

Array Type:

LINEAR

Body Width:

29.21 inch

Body Height:

1.77 mm

Body Length/Diameter:

29.21 mm

Dynamic Range:

72 dB

Mounting Feature:

Maximum Operating Temperature:

60 Cel

Minimum Operating Temperature:

0 Cel

Output Range:

Output Type:

Package Shape or Style:

Pixel Size (um):

15X15

Sensors or Transducers Type:

Maximum Supply Voltage:

5 V

Termination Type:

SOLDER

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 12