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CS-514-6FN28

Onsemi

CS-514-6FN28 by Onsemi

CS-514-6FN28 by Onsemi is a 28-terminal drive electronics chip carrier with 6 channels. It operates at power supplies of 5V and 12V, using bipolar technology. The surface-mount square package is made of plastic/epoxy, with terminals finished in Tin/Lead (Sn/Pb), ideal for various electronic applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,033 parts In-Stock

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1,033

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Vyrian

USA . 849 parts In-Stock

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849

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 880 parts In-Stock

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$10.392

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880

$10.392

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Northwest PG Solutions

USA . 279 parts In-Stock

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$11.431

100+ parts

$10.288

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279

$11.431

$10.288

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Kulean Microsystems

USA . 5,356 parts In-Stock

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5,356

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Problanco Electronics

Mexico . 3,988 parts In-Stock

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3,988

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SupplyDigital Components

Austria . 3,374 parts In-Stock

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3,374

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TANS Electronics

Latvia . 824 parts In-Stock

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824

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Corphita

USA . 818 parts In-Stock

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818

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UHIMA Technologies

Türkiye . 254 parts In-Stock

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254

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Corohmni

South Africa . 181 parts In-Stock

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Overview

Enhance your electronic projects with the CS-514-6FN28 by Onsemi, a premium drive electronics component designed to provide reliable performance and durability. Manufactured by industry leader Onsemi, this product offers superior quality and precision engineering. Ideal for a wide range of applications, this chip carrier features 6 channels and 28 terminals, making it a versatile choice for power supplies. Trust Onsemi to deliver top-notch technology and innovation in every product, ensuring that you get the best value and performance for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and strong protection for the drive electronics, ensuring a longer lifespan.

Surface Mount: YES

Being surface mountable enables easy and efficient installation on circuit boards, saving time and effort during assembly.

Package Shape: SQUARE

The square package shape allows for efficient use of space on the circuit board, optimizing the overall design layout.

Power Supplies (V): 5,12

The ability to support multiple power supply voltages (5V and 12V) offers flexibility in compatibility with different systems and devices.

No. of Terminals: 28

The high number of terminals allows for multiple connections and functionalities, making the drive electronics versatile in its applications.

Package Style (Meter): CHIP CARRIER

The chip carrier package style provides efficient heat dissipation and protection for the drive electronics, ensuring optimal performance.

Terminal Finish: Tin/Lead (Sn/Pb)

The tin/lead terminal finish enhances conductivity and reliability of the connections, reducing the risk of signal loss or interference.

Terminal Position: QUAD

The quad terminal position allows for easier and more secure connections on the circuit board, improving overall stability and performance.

No. of Channels: 6

With six channels, the drive electronics can handle multiple inputs and outputs simultaneously, increasing efficiency and reducing the need for additional components.

Technology: BIPOLAR

Bipolar technology offers high performance and precision in signal processing, making the drive electronics suitable for demanding applications requiring accurate data processing.

Terminal Form: J BEND

The J bend terminal form provides a secure and reliable connection on the circuit board, minimizing the risk of disconnection or signal loss.

Terminal Pitch: 1.27 mm

The 1.27mm terminal pitch allows for precise and compact placement of the drive electronics on the circuit board, optimizing space utilization and overall design efficiency.

Technical Specifications

Drive Electronics CS-514-6FN28 attributes and parameters. Explore more Drive Electronics devices from Onsemi

Specs

JESD-30 Code:

S-PQCC-J28

JESD-609 Code:

e0

No. of Channels:

6

No. of Terminals:

28

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

5,12

Qualification:

Not Qualified

Sub-Category:

Drive Electronics

Surface Mount:

YES

Technology:

BIPOLAR

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Trade Compliance

CS-514-6FN28 Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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