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CS-514-6DW28

Onsemi

CS-514-6DW28 by Onsemi

CS-514-6DW28 by Onsemi is a 6-channel drive electronics with power supplies of 5V and 12V. It features a small outline package style, dual terminal position, and gull wing terminal form. Ideal for applications requiring bipolar technology in surface mount configurations.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 2,010 parts In-Stock

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2,010

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Vyrian

USA . 1,438 parts In-Stock

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1,438

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Distributors (Availability)

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Native Components

USA . 825 parts In-Stock

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$1.073

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825

$1.073

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Northwest PG Solutions

USA . 14 parts In-Stock

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$1.180

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14

$1.180

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Kulean Microsystems

USA . 7,953 parts In-Stock

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7,953

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TANS Electronics

Latvia . 4,153 parts In-Stock

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Problanco Electronics

Mexico . 3,130 parts In-Stock

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Corphita

USA . 2,310 parts In-Stock

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2,310

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SupplyDigital Components

Austria . 2,231 parts In-Stock

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UHIMA Technologies

Türkiye . 796 parts In-Stock

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Corohmni

South Africa . 371 parts In-Stock

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Overview

Elevate your electronic devices with the CS-514-6DW28 by Onsemi, a cutting-edge drive electronics component that promises unparalleled quality and reliability. Manufactured by industry leader Onsemi, this product boasts a sleek design and advanced technology for seamless integration into your applications. Perfect for power supplies of 5V and 12V, this component offers 6 channels for optimal performance. Say goodbye to subpar electronics and hello to superior functionality with the CS-514-6DW28 by Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides excellent durability and resistance to heat, making the product reliable for long-term use.

Surface Mount: YES

Surface mount technology allows for easy installation and compact design, saving space and improving overall efficiency.

Package Shape: RECTANGULAR

Rectangular package shape offers easy integration into existing systems and ensures compatibility with standard mounting methods.

Power Supplies (V): 5,12

Support for multiple power supply options (5V and 12V) provides flexibility in different applications, allowing for versatile use.

No. of Terminals: 28

Having 28 terminals allows for a high level of connectivity and functionality, enabling more complex operations and connections.

Package Style (Meter): SMALL OUTLINE

Small outline package style helps in reducing overall size and weight of the product, making it ideal for space-constrained installations.

Terminal Finish: Tin/Lead (Sn/Pb)

Tin/Lead terminal finish provides good conductivity and solderability, ensuring secure connections and reliable performance.

Terminal Position: DUAL

Dual terminal position allows for increased versatility in wiring configurations and enhances overall connectivity options.

No. of Channels: 6

With 6 channels, the product can handle multiple inputs and outputs simultaneously, enhancing its capability for complex tasks.

Technology: BIPOLAR

Bipolar technology offers stable performance and robustness, providing consistent operation in different environmental conditions.

Terminal Form: GULL WING

Gull wing terminal form ensures secure soldering and easy handling during installation, reducing the risk of connection issues.

Terminal Pitch: 1.27 mm

With a terminal pitch of 1.27mm, the product allows for precise and compact wiring, enabling efficient connections in tight spaces.

Technical Specifications

Drive Electronics CS-514-6DW28 attributes and parameters. Explore more Drive Electronics devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e0

No. of Channels:

6

No. of Terminals:

28

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5,12

Qualification:

Not Qualified

Sub-Category:

Drive Electronics

Surface Mount:

YES

Technology:

BIPOLAR

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

CS-514-6DW28 Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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