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CS-510A-4N22

Onsemi

CS-510A-4N22 by Onsemi

CS-510A-4N22 by Onsemi is a Drive Electronics component with 4 channels, operating at 5V and 12V. Featuring a rectangular package style with 22 terminals in dual position, it uses bipolar technology and has tin/lead terminal finish. Ideal for applications requiring precise power supply control.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,071 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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2,071

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Vyrian

USA . 1,531 parts In-Stock

1+ parts

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1k+ parts

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1,531

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 325 parts In-Stock

1+ parts

$0.277

100+ parts

-

1k+ parts

-

10k+ parts

$0.266

325

$0.277

-

-

$0.266

Northwest PG Solutions

USA . 418 parts In-Stock

1+ parts

$0.305

100+ parts

-

1k+ parts

-

10k+ parts

$0.269

418

$0.305

-

-

$0.269

Kulean Microsystems

USA . 7,798 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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7,798

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SupplyDigital Components

Austria . 7,770 parts In-Stock

1+ parts

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7,770

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Problanco Electronics

Mexico . 3,947 parts In-Stock

1+ parts

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3,947

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TANS Electronics

Latvia . 3,009 parts In-Stock

1+ parts

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3,009

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Corphita

USA . 1,810 parts In-Stock

1+ parts

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1,810

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Corohmni

South Africa . 376 parts In-Stock

1+ parts

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376

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UHIMA Technologies

Türkiye . 247 parts In-Stock

1+ parts

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100+ parts

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247

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Overview

Elevate your electronics projects with the CS-510A-4N22 by Onsemi. Known for their superior quality and reliability, Onsemi delivers cutting-edge drive electronics that guarantee top-notch performance. Perfect for a wide range of applications, this product offers unmatched value with its advanced technology and efficient power supplies. With 4 channels and 22 terminals, the CS-510A-4N22 is designed to meet all your electronic needs. Upgrade your projects today with Onsemi's industry-leading drive electronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and protects the internal components of the product from damage, ensuring a longer lifespan.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for easy integration into various electronic systems and makes it space-efficient.

Power Supplies (V): 5,12

The product supports power supplies of 5V and 12V, making it versatile and compatible with a wide range of electronic devices.

No. of Terminals: 22

The high number of terminals allows for connectivity with multiple devices or components, enhancing the functionality of the product.

Package Style (Meter): IN-LINE

The in-line package style simplifies the installation process and makes it easy to connect the product to other devices in a linear fashion.

Terminal Finish: Tin/Lead (Sn/Pb)

The tin/lead terminal finish ensures good conductivity and reliable connections, improving the overall performance of the product.

Terminal Position: DUAL

Having dual terminal positions allows for flexibility in installation and ensures a secure connection between the product and external devices.

No. of Channels: 4

With 4 channels available, the product can handle multiple signals simultaneously, making it suitable for applications that require processing and control of multiple inputs/outputs.

Technology: BIPOLAR

The use of bipolar technology provides high precision and accuracy in signal processing, making the product reliable and efficient for various electronic applications.

Terminal Form: THROUGH-HOLE

The through-hole terminal form simplifies the soldering process and ensures a strong mechanical connection between the product and the circuit board, enhancing its durability.

Terminal Pitch: 2.54 mm

The 2.54mm terminal pitch allows for easy installation and alignment of the product on a breadboard or PCB, making it user-friendly for electronics enthusiasts and professionals.

Technical Specifications

Drive Electronics CS-510A-4N22 attributes and parameters. Explore more Drive Electronics devices from Onsemi

Specs

JESD-30 Code:

R-PDIP-T22

JESD-609 Code:

e0

No. of Channels:

4

No. of Terminals:

22

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP22,.4

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5,12

Qualification:

Not Qualified

Sub-Category:

Drive Electronics

Surface Mount:

NO

Technology:

BIPOLAR

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

CS-510A-4N22 Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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