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CS-514-2RDW18

Onsemi

CS-514-2RDW18 by Onsemi

CS-514-2RDW18 by Onsemi is a Drive Electronics with 2 channels, operating at 5V and 12V. It features a small outline package shape made of plastic/epoxy material for surface mount applications. The device has 18 terminals in gull wing form with tin/lead finish, suitable for bipolar technology applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 911 parts In-Stock

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911

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Vyrian

USA . 488 parts In-Stock

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488

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Northwest PG Solutions

USA . 1,304 parts In-Stock

1+ parts

$3.372

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1,304

$3.372

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Problanco Electronics

Mexico . 6,400 parts In-Stock

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6,400

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TANS Electronics

Latvia . 3,047 parts In-Stock

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3,047

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Native Components

USA . 879 parts In-Stock

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$2.973

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879

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$2.973

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Kulean Microsystems

USA . 837 parts In-Stock

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837

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Corphita

USA . 762 parts In-Stock

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762

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Corohmni

South Africa . 260 parts In-Stock

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260

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UHIMA Technologies

Türkiye . 253 parts In-Stock

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253

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SupplyDigital Components

Austria . 85 parts In-Stock

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Overview

Unlock the potential of your electronic devices with the CS-514-2RDW18 by Onsemi. Crafted with precision and expertise, this drive electronics component offers unparalleled quality and reliability. From power supplies to terminals, every detail is designed to enhance performance. Whether you're working on robotics, automotive systems, or industrial machinery, this product ensures seamless operation and efficiency. Elevate your projects with the CS-514-2RDW18 and experience the superior value it brings to your creations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, ideal for portable devices.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on PCBs, saving space and making assembly processes faster.

Power Supplies (V): 5,12

The product supports multiple power supply options (5V and 12V), providing versatility and compatibility with a wide range of systems.

No. of Terminals: 18

With 18 terminals available, the product offers ample connectivity options for multiple input and output configurations, enhancing flexibility in design.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB, making it suitable for compact devices where real estate is limited.

Technology: BIPOLAR

Utilizing bipolar technology ensures reliable and stable performance, making the product suitable for applications where precision and accuracy are critical.

Terminal Pitch: 1.27 mm

The small terminal pitch of 1.27mm allows for high-density mounting and facilitates fine-pitch interconnection, enabling compact designs with increased functionality.

Technical Specifications

Drive Electronics CS-514-2RDW18 attributes and parameters. Explore more Drive Electronics devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G18

JESD-609 Code:

e0

No. of Channels:

2

No. of Terminals:

18

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP18,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5,12

Qualification:

Not Qualified

Sub-Category:

Drive Electronics

Surface Mount:

YES

Technology:

BIPOLAR

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

CS-514-2RDW18 Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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