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L6000

STMicroelectronics

L6000 by STMicroelectronics

L6000 by STMicroelectronics is a BICMOS interface IC designed for drive electronics, operating b/w 4.3V and 5.5V with a max temp of 70 °C. It features a compact square flatpack design with 64 terminals and 0.5mm pitch. Ideal for high-performance read channel applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Q Components

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

2,500

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-

-

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Anansix

USA . 958 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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958

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-

-

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Vyrian

USA . 671 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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671

-

-

-

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Digiode

USA . 172 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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172

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,242 parts In-Stock

1+ parts

$1.845

100+ parts

-

1k+ parts

$1.660

10k+ parts

-

2,242

$1.845

-

$1.660

-

MKK Technologies

India . 1,531 parts In-Stock

1+ parts

$3.469

100+ parts

-

1k+ parts

-

10k+ parts

-

1,531

$3.469

-

-

-

DigiPath Technology Company

USA . 1,531 parts In-Stock

1+ parts

$3.469

100+ parts

-

1k+ parts

-

10k+ parts

-

1,531

$3.469

-

-

-

Authorized Procurement Solutions

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,000

-

-

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Corphita

USA . 3,751 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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3,751

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-

-

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Kepictronics

USA . 1,850 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,850

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-

-

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Parana Technologies

USA . 6 parts In-Stock

1+ parts

-

100+ parts

$2.206

1k+ parts

-

10k+ parts

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6

-

$2.206

-

-

Overview

Elevate your drive electronics with the L6000 from STMicroelectronics, where cutting-edge technology meets exceptional reliability. Designed for precision and efficiency, this compact solution ensures seamless performance across diverse applications—from automotive systems to industrial controls. With STMicroelectronics' renowned commitment to quality, the L6000 empowers businesses to innovate while maximizing value and minimizing risks, making it the smart choice for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to environmental factors, making the product reliable for various applications.

Surface Mount: YES

Being surface mount allows for more compact designs and easier integration into modern circuit boards, enhancing overall performance.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V provides flexibility, accommodating a wide range of applications without exceeding voltage limits.

Package Shape: SQUARE

The square package shape is ideal for uniform PCB layouts, enabling efficient space utilization in electronic designs.

Power Supplies: 5 V

Operates at a standard 5 V supply, which is common in many electronic devices, simplifying design and power management.

No. of Terminals: 64

With 64 terminals, this device offers ample connectivity for complex applications, supporting various functionalities.

Package Style (Meter): FLATPACK, FINE PITCH

The flatpack, fine pitch design allows for high-density placement on PCBs, making it suitable for space-constrained applications.

Minimum Supply Voltage: 4.3 V

A minimum supply voltage of 4.3 V ensures operational flexibility while maintaining reliability in varying voltage conditions.

Maximum Operating Temperature: 70 °C

Operating up to 70 °C allows for usage in diverse environments, contributing to device longevity and stable performance.

Minimum Operating Temperature: 0 °C

A minimum operating temperature of 0 °C ensures that the product can function effectively in standard conditions without risk of failure.

Terminal Finish: TIN LEAD

Tin-lead terminal finish provides excellent solderability and durability during connections, ensuring reliable performance.

Terminal Position: QUAD

The quad terminal position allows for efficient routing of connections on a PCB, facilitating better circuit design.

Maximum Seated Height: 1.85 mm

A maximum seated height of 1.85 mm enables a low-profile design, ideal for applications where space is a constraint.

Width: 10 mm

A width of 10 mm makes the component easy to fit into standard PCB layouts, promoting compatibility with various systems.

Length: 10 mm

The 10 mm length allows for compact integration in electronic assemblies, optimizing space and efficiency.

Temperature Grade: COMMERCIAL

A commercial temperature grade signifies that the device is designed for general-purpose applications, maximizing usability.

Technology: BICMOS

BICMOS technology combines the benefits of bipolar and CMOS, offering high performance and low power consumption.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and ensure strong mechanical connection, enhancing reliability.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5 V is standard in many circuits, ensuring compatibility and ease of integration in existing designs.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm enables higher density connections, allowing for more complex functionalities in a compact form.

Interface IC Type: READ CHANNEL

As a READ CHANNEL interface IC, this product is tailored for efficient data transfer, making it a great choice for signal processing applications.

Technical Specifications

Drive Electronics L6000 attributes and parameters. Explore more Drive Electronics devices from STMicroelectronics

Specs

Interface IC Type:

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e0

Length:

10 mm

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP64,.47SQ

Package Shape:

Package Style (Meter):

FLATPACK, FINE PITCH

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.85 mm

Sub-Category:

Drive Electronics

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.3 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

10 mm

Trade Compliance

L6000 Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5340-01-251-3708, 5340012513708, 6210-98-204-7674, 6210982047674

NIIN

012513708, 982047674

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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