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CS-510A-4RN22

Onsemi

CS-510A-4RN22 by Onsemi

CS-510A-4RN22 by Onsemi is a 4-channel drive electronics device with power supplies of 5V and 12V. Featuring bipolar technology, it has 22 terminals in an inline package style for through-hole mounting. Ideal for applications requiring precise control over multiple channels in electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,975 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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1,975

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Vyrian

USA . 791 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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791

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 335 parts In-Stock

1+ parts

$0.400

100+ parts

-

1k+ parts

-

10k+ parts

$0.384

335

$0.400

-

-

$0.384

Northwest PG Solutions

USA . 520 parts In-Stock

1+ parts

$0.440

100+ parts

-

1k+ parts

-

10k+ parts

$0.388

520

$0.440

-

-

$0.388

TANS Electronics

Latvia . 7,212 parts In-Stock

1+ parts

-

100+ parts

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7,212

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Problanco Electronics

Mexico . 7,128 parts In-Stock

1+ parts

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7,128

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-

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SupplyDigital Components

Austria . 5,775 parts In-Stock

1+ parts

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5,775

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Corphita

USA . 1,554 parts In-Stock

1+ parts

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1,554

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Corohmni

South Africa . 315 parts In-Stock

1+ parts

-

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315

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UHIMA Technologies

Türkiye . 222 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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222

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Kulean Microsystems

USA . 84 parts In-Stock

1+ parts

-

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1k+ parts

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84

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Overview

Experience unparalleled quality and performance with the CS-510A-4RN22 by Onsemi. As a leading manufacturer in drive electronics, Onsemi delivers exceptional reliability and innovation in every product. Whether you're looking to enhance your power supplies or optimize your electronic systems, this product offers unmatched value and benefits. With its advanced technology and versatile applications, the CS-510A-4RN22 is the perfect choice for all your electronics needs. Choose Onsemi for superior products that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and lightweight, making the product suitable for various applications while ensuring longevity.

Package Shape: RECTANGULAR

The rectangular shape allows for easy mounting and efficient use of space in electronic setups.

Power Supplies (V): 5,12

The product can operate with multiple voltage inputs, providing flexibility in power supply options.

No. of Terminals: 22

The ample number of terminals allows for easy connectivity and integration with other electronic components.

Package Style (Meter): IN-LINE

The in-line design simplifies the installation process and enhances the overall organization of the electronic setup.

Terminal Finish: Tin/Lead (Sn/Pb)

This finish ensures good conductivity and solderability, making the terminals reliable for long-term use.

Terminal Position: DUAL

The dual terminal position provides redundancy and enhances the stability of connections, reducing the risk of signal loss.

No. of Channels: 4

With four channels, the product can handle multiple inputs or outputs simultaneously, increasing its versatility.

Technology: BIPOLAR

Bipolar technology offers precise control and efficient performance, making the product ideal for demanding applications.

Terminal Form: THROUGH-HOLE

Through-hole terminals are sturdy and easy to solder, ensuring reliable connections in various electronic setups.

Terminal Pitch: 2.54 mm

The standardized terminal pitch of 2.54 mm allows for compatibility with a wide range of connectors and accessories.

Technical Specifications

Drive Electronics CS-510A-4RN22 attributes and parameters. Explore more Drive Electronics devices from Onsemi

Specs

JESD-30 Code:

R-PDIP-T22

JESD-609 Code:

e0

No. of Channels:

4

No. of Terminals:

22

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP22,.4

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5,12

Qualification:

Not Qualified

Sub-Category:

Drive Electronics

Surface Mount:

NO

Technology:

BIPOLAR

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

CS-510A-4RN22 Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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