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DP84910VHG-36

Texas Instruments

DP84910VHG-36 by Texas Instruments

DP84910VHG-36 by Texas Instruments is a drive electronics IC with 80 terminals, operating at 0-70°C. It has a supply voltage range of 4.5-5.5 V and max current of 220 mA. Ideal for read channel interface applications due to its low profile flatpack package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

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Digiode

USA . 4,318 parts In-Stock

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4,318

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Electronic Expediters

USA . 3,030 parts In-Stock

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Vyrian

USA . 2,616 parts In-Stock

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Cyclops Electronics Ltd

UK . 1,190 parts In-Stock

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Q Components

USA . 682 parts In-Stock

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682

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Anansix

USA . 395 parts In-Stock

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395

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Connector Distribution Corp

USA . 76 parts In-Stock

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76

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Right Parts Inc.

USA . 76 parts In-Stock

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Aztec Data Supply Inc.

USA . 40 parts In-Stock

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$3.112

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40

$3.112

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Native Components

USA . 992 parts In-Stock

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$9.076

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992

$9.076

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Northwest PG Solutions

USA . 1,997 parts In-Stock

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$9.984

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$8.985

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$9.984

$8.985

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Parana Technologies

USA . 1,318 parts In-Stock

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$12.380

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$12.819

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DigiPath Technology Company

USA . 1,665 parts In-Stock

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$13.632

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ChromeModa Solutions

Germany . 2,800 parts In-Stock

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$13.910

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$11.406

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$13.910

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IDEA Electronic Components Group

UK . 1,998 parts In-Stock

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$13.910

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$13.214

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$12.519

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$13.910

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AZTECH Wire

Italy . 652 parts In-Stock

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$13.993

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One Stop Electronics

USA . 1,020 parts In-Stock

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$15.500

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$15.500

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Alle Elektronik GmbH

Germany . 4,839 parts In-Stock

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Glotronic Ltd.

UK . 3,500 parts In-Stock

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Authorized Procurement Solutions

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Corphita

USA . 1,502 parts In-Stock

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Metaverse IC Inc.

Canada . 1,190 parts In-Stock

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Kepictronics

USA . 38 parts In-Stock

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Overview

Enhance your electronic devices with the DP84910VHG-36 by Texas Instruments, a top-quality drive electronics component that promises reliability and efficiency. With Texas Instruments' reputation for excellence in manufacturing, this product is designed to exceed expectations. Ideal for a wide range of applications, this drive electronics module offers unmatched value and benefits to customers looking for superior performance and durability. Upgrade your electronics with Texas Instruments' DP84910VHG-36 and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the drive electronics, making it resistant to damage from environmental factors.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation onto circuit boards, saving space and reducing assembly time.

Maximum Supply Voltage: 5.5 V

With a maximum supply voltage of 5.5V, this drive electronics product can safely operate within standard voltage ranges without risk of damage.

Package Shape: SQUARE

Square package shape offers a compact design that can easily fit into various electronic devices, maximizing space efficiency.

Power Supplies (V): 5

With a power supply of 5V, this drive electronics product can efficiently power the connected components, ensuring optimal performance.

No. of Terminals: 80

Having 80 terminals allows for connectivity to a wide range of devices and peripherals, increasing the versatility of this product.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, fine pitch style of the package makes this drive electronics product suitable for compact and high-density applications.

Minimum Supply Voltage: 4.5 V

With a minimum supply voltage of 4.5V, this product can maintain stable operation even under lower voltage conditions.

Maximum Operating Temperature: 70 °C

Operating at a maximum temperature of 70°C ensures reliable performance in various environments without the risk of overheating.

Minimum Operating Temperature: 0 °C

Capable of operating at a minimum temperature of 0°C, this product can function effectively in both high and low temperature environments.

Terminal Finish: TIN LEAD

Tin lead terminal finish provides excellent conductivity and solderability, ensuring a secure connection between the drive electronics and other components.

Terminal Position: QUAD

The quad terminal position offers a stable and reliable connection layout, reducing the risk of signal loss or interference.

Maximum Seated Height: 1.5 mm

The maximum seated height of 1.5mm allows for a low-profile design that can be easily integrated into compact electronic devices.

Width: 12 mm

The 12mm width provides a compact form factor that can fit into tight spaces while still offering ample connectivity options.

Length: 12 mm

With a length of 12mm, this drive electronics product is compact and efficient, making it suitable for space-constrained applications.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures reliable operation in standard temperature conditions, making this product ideal for commercial applications.

Terminal Form: GULL WING

Gull wing terminal form allows for easy soldering and secure connections, enhancing the overall durability and reliability of the drive electronics.

Maximum Supply Current: 220 mA

With a maximum supply current of 220mA, this product can provide sufficient power to the connected components without risking overheating or damage.

Nominal Supply Voltage: 5 V

Having a nominal supply voltage of 5V ensures stable and consistent power delivery to the drive electronics, maximizing performance and reliability.

Terminal Pitch: 0.5 mm

With a terminal pitch of 0.5mm, this product offers high-density connectivity options, allowing for more connections in a small space.

Interface IC Type: READ CHANNEL

The read channel interface IC type offers advanced functionality for data reading and communication, making this product suitable for high-speed data transfer applications.

Technical Specifications

Drive Electronics DP84910VHG-36 attributes and parameters. Explore more Drive Electronics devices from Texas Instruments

Specs

Interface IC Type:

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e0

Length:

12 mm

No. of Functions:

1

No. of Terminals:

80

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.55SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.5 mm

Sub-Category:

Drive Electronics

Maximum Supply Current:

220 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

12 mm

Trade Compliance

DP84910VHG-36 Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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