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CS-570N28

Onsemi

CS-570N28 by Onsemi

CS-570N28 by Onsemi is a Drive Electronics component with 2 channels, operating at 0-70 °C. It features 5V/12V power supplies, 28 terminals in IN-LINE package style. Ideal for commercial applications requiring bipolar technology and tin/lead terminal finish.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,236 parts In-Stock

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2,236

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Digiode

USA . 1,996 parts In-Stock

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1,996

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Northwest PG Solutions

USA . 493 parts In-Stock

1+ parts

$2.725

100+ parts

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493

$2.725

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Kulean Microsystems

USA . 8,155 parts In-Stock

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8,155

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TANS Electronics

Latvia . 6,814 parts In-Stock

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6,814

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Problanco Electronics

Mexico . 6,060 parts In-Stock

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6,060

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SupplyDigital Components

Austria . 3,930 parts In-Stock

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3,930

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Corphita

USA . 2,428 parts In-Stock

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2,428

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Native Components

USA . 692 parts In-Stock

1+ parts

-

100+ parts

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$2.403

10k+ parts

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692

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$2.403

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UHIMA Technologies

Türkiye . 617 parts In-Stock

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617

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Corohmni

South Africa . 233 parts In-Stock

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233

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Overview

Discover the CS-570N28 by Onsemi, a cutting-edge drive electronics solution that delivers unmatched quality and reliability. Manufactured by Onsemi, a trusted industry leader, this product is designed to excel in various applications. With its innovative technology and robust construction, the CS-570N28 offers customers exceptional value, efficiency, and performance. Experience seamless operation and superior results with the CS-570N28 – the ultimate choice for all your electronic drive needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material makes the product durable and resistant to environmental conditions, ensuring long-term reliability.

Package Shape: RECTANGULAR

Rectangular shape allows for easy integration into various electronic devices and simplifies the manufacturing process.

Power Supplies (V): 5,12

Provides flexibility in power options, making the product compatible with a wide range of applications.

No. of Terminals: 28

Ample number of terminals allows for easy connectivity and integration with other components, enhancing functionality.

Package Style (Meter): IN-LINE

In-line package style is space-efficient and allows for easy placement within electronic systems.

Maximum Operating Temperature: 70 °C

High maximum operating temperature allows the product to perform reliably even in challenging environments.

Minimum Operating Temperature: 0 °C

Wide operating temperature range ensures the product can function effectively in different temperature conditions.

Terminal Finish: Tin/Lead (Sn/Pb)

Tin/Lead terminal finish provides good conductivity and solderability, making it easy to integrate the product into circuits.

Terminal Position: DUAL

Dual terminal position offers flexibility in connecting the product and supports multiple connection options.

Temperature Grade: COMMERCIAL

Commercial temperature grade indicates the product is suitable for standard commercial use, making it a cost-effective choice.

No. of Channels: 2

Two channels offer dual functionality or input/output options, increasing the versatility of the product.

Technology: BIPOLAR

Bipolar technology provides efficient performance and stable operation, enhancing the reliability of the product.

Terminal Form: THROUGH-HOLE

Through-hole terminal form is robust and secure, ensuring stable and durable connections.

Terminal Pitch: 2.54 mm

Standard terminal pitch facilitates easy mounting and soldering, simplifying the installation process.

Technical Specifications

Drive Electronics CS-570N28 attributes and parameters. Explore more Drive Electronics devices from Onsemi

Specs

JESD-30 Code:

R-PDIP-T28

JESD-609 Code:

e0

No. of Channels:

2

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP28,.6

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5,12

Qualification:

Not Qualified

Sub-Category:

Drive Electronics

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

CS-570N28 Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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