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MC100E197FNR2

Onsemi

MC100E197FNR2 by Onsemi

MC100E197FNR2 by Onsemi is a drive electronics chip with 28 terminals, operating voltage range of 4.2V to 5.7V, and max supply current of 180mA. It is used as a pulse detector in applications requiring ECL100K technology, such as high-speed data communication systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,083 parts In-Stock

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1,083

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Digiode

USA . 350 parts In-Stock

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350

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Kulean Microsystems

USA . 6,369 parts In-Stock

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6,369

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TANS Electronics

Latvia . 4,966 parts In-Stock

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4,966

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Problanco Electronics

Mexico . 4,428 parts In-Stock

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Corphita

USA . 2,187 parts In-Stock

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SupplyDigital Components

Austria . 896 parts In-Stock

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896

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Corohmni

South Africa . 428 parts In-Stock

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428

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UHIMA Technologies

Türkiye . 285 parts In-Stock

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Overview

Discover the MC100E197FNR2 by Onsemi, a high-quality drive electronics component designed to enhance performance and efficiency in a wide range of applications. Manufactured by the reputable Onsemi brand, this product offers reliable operation and innovative features that set it apart from competitors. With its advanced technology and versatile design, the MC100E197FNR2 provides customers with exceptional value and benefits, making it an ideal choice for projects requiring precision and reliability. Upgrade your electronics with the MC100E197FNR2 and experience the difference in quality and performance today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, perfect for electronic devices that need to be portable and long-lasting.

Surface Mount: YES

Surface mount capability makes installation easier and saves space on the circuit board, making the product more efficient and cost-effective.

Maximum Supply Voltage: 5.7 V

With a high maximum supply voltage, this product can handle a wide range of power inputs, making it versatile and suitable for various applications.

Package Shape: SQUARE

The square package shape allows for easy integration into circuit designs and ensures a compact overall footprint.

No. of Terminals: 28

Having a high number of terminals provides flexibility in connecting the product to other components, allowing for more complex circuit designs.

Maximum Operating Temperature: 85 °C

A high maximum operating temperature ensures the product can withstand harsh environmental conditions, making it reliable in a wide range of applications.

Power Supplies (V): -4.5

The negative power supply voltage allows for specific functions that require a balanced power input, enhancing the product's capabilities for certain applications.

Technical Specifications

Drive Electronics MC100E197FNR2 attributes and parameters. Explore more Drive Electronics devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC=0 VEE=-4.2V TO -5.7V

Interface IC Type:

JESD-30 Code:

S-PQCC-J28

JESD-609 Code:

e0

Length:

11.505 mm

Nominal Negative Supply Voltage:

-4.5 V

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

-4.5

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Drive Electronics

Maximum Supply Current:

180 mA

Maximum Supply Voltage:

5.7 V

Minimum Supply Voltage:

4.2 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

ECL100K

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

11.505 mm

Trade Compliance

MC100E197FNR2 Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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