Loading...

MC10E197FNR2

Onsemi

MC10E197FNR2 by Onsemi

MC10E197FNR2 by Onsemi is a drive electronics chip carrier with ECL10K technology. It operates b/w 4.2V to 5.7V, consuming up to 180mA at -5.2V supply voltage. Ideal for pulse detection applications due to its quad terminal position and compact square package design.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,369 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,369

-

-

-

-

Vyrian

USA . 2,256 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,256

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Kulean Microsystems

USA . 5,178 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,178

-

-

-

-

Problanco Electronics

Mexico . 2,694 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,694

-

-

-

-

Corphita

USA . 1,285 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,285

-

-

-

-

SupplyDigital Components

Austria . 987 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

987

-

-

-

-

UHIMA Technologies

Türkiye . 902 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

902

-

-

-

-

TANS Electronics

Latvia . 459 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

459

-

-

-

-

Corohmni

South Africa . 332 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

332

-

-

-

-

Overview

Experience superior performance and reliability with the MC10E197FNR2 by Onsemi. As a leading manufacturer in the industry, Onsemi delivers cutting-edge drive electronics that are essential for various applications. This product offers unmatched value, benefits, and advantages to customers seeking high-quality solutions. Upgrade your systems with the MC10E197FNR2 and enjoy seamless operation, enhanced efficiency, and exceptional results. Trust Onsemi for all your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight, durable, and cost-effective, making the product easy to handle and transport.

Surface Mount: YES

Being surface mountable allows for easy integration onto circuit boards, reducing assembly time and complexity.

Maximum Supply Voltage: 5.7 V

With a high maximum supply voltage, this product can handle a wide range of power inputs, increasing versatility.

Package Shape: SQUARE

The square shape of the package allows for efficient use of space on the circuit board, optimizing layout design.

Power Supplies (V): -5.2

Having a negative power supply voltage of -5.2 V enables compatibility with various electronic systems requiring such power input.

No. of Terminals: 28

Having a high number of terminals allows for connectivity with multiple components, enhancing the functionality of the product.

Package Style (Meter): CHIP CARRIER

The chip carrier package style provides protection to the internal components and ensures reliable performance.

Minimum Supply Voltage: 4.2 V

The low minimum supply voltage enables operation in scenarios where power input is limited, conserving energy.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the product can withstand elevated temperatures, ensuring durability and reliability.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature allows for operation in cold environments without compromising performance.

Terminal Finish: Tin/Lead (Sn80Pb20)

The tin/lead terminal finish provides good solderability and conductivity, ensuring secure connections and efficient signal transfer.

Terminal Position: QUAD

The quad terminal position allows for easy placement and soldering onto the circuit board, simplifying the assembly process.

Maximum Seated Height: 4.57 mm

With a low seated height, the product can fit into compact spaces, making it suitable for applications with limited vertical clearance.

Width: 11.505 mm

The moderate width of the product ensures compatibility with standard PCB layouts, facilitating easy integration into existing systems.

Length: 11.505 mm

The moderate length of the product allows for flexible placement within the circuit board, accommodating different layout configurations.

Technology: ECL10K

The ECL10K technology offers high-speed performance and low power consumption, making the product suitable for demanding electronic applications.

Terminal Form: J BEND

The J bend terminal form simplifies the soldering process and enhances mechanical stability, ensuring reliable connections.

Maximum Supply Current: 180 mA

With a high maximum supply current, the product can deliver sufficient power to drive various electronic components, enhancing overall system performance.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5 V allows for seamless integration with standard power sources, ensuring compatibility with a wide range of systems.

Nominal Negative Supply Voltage: -5.2 V

The nominal negative supply voltage of -5.2 V enables consistent and stable operation in applications requiring negative power inputs.

Terminal Pitch: 1.27 mm

The small terminal pitch allows for high-density mounting on the circuit board, maximizing space efficiency and enabling miniaturization of electronic devices.

Interface IC Type: PULSE DETECTOR

The pulse detector interface IC type provides accurate and reliable detection of pulse signals, making the product ideal for applications requiring precise signal processing.

Technical Specifications

Drive Electronics MC10E197FNR2 attributes and parameters. Explore more Drive Electronics devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -4.2V TO -5.7V

Interface IC Type:

JESD-30 Code:

S-PQCC-J28

JESD-609 Code:

e0

Length:

11.505 mm

Moisture Sensitivity Level (MSL):

1

Nominal Negative Supply Voltage:

-5.2 V

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

-5.2

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Drive Electronics

Maximum Supply Current:

180 mA

Maximum Supply Voltage:

5.7 V

Minimum Supply Voltage:

4.2 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

ECL10K

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn80Pb20)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

11.505 mm

Trade Compliance

MC10E197FNR2 Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 4