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CS-541D24

Onsemi

CS-541D24 by Onsemi

CS-541D24 by Onsemi is a Drive Electronics component with 24 terminals, operating at 5V and 12V. It features a small outline package style, Gull Wing terminal form, and Bipolar technology. Ideal for surface mount applications requiring plastic/epoxy package material.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,260 parts In-Stock

1+ parts

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100+ parts

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2,260

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Vyrian

USA . 1,784 parts In-Stock

1+ parts

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1k+ parts

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1,784

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 345 parts In-Stock

1+ parts

$5.185

100+ parts

-

1k+ parts

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10k+ parts

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345

$5.185

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Kulean Microsystems

USA . 7,824 parts In-Stock

1+ parts

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1k+ parts

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7,824

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SupplyDigital Components

Austria . 4,642 parts In-Stock

1+ parts

-

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4,642

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Problanco Electronics

Mexico . 2,453 parts In-Stock

1+ parts

-

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2,453

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-

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Corphita

USA . 1,395 parts In-Stock

1+ parts

-

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1,395

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Northwest PG Solutions

USA . 1,019 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$5.081

10k+ parts

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1,019

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-

$5.081

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TANS Electronics

Latvia . 683 parts In-Stock

1+ parts

-

100+ parts

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683

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Corohmni

South Africa . 242 parts In-Stock

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242

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UHIMA Technologies

Türkiye . 84 parts In-Stock

1+ parts

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84

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Overview

Elevate your electronics game with the CS-541D24 by Onsemi, a top-tier drive electronics solution that guarantees quality and reliability. Manufactured by Onsemi, a renowned industry leader, this product is designed to excel in a wide range of applications, making it a versatile choice for any project. With its advanced technology and user-friendly features, the CS-541D24 offers unmatched value and benefits to customers, ensuring seamless integration and optimal performance. Upgrade your electronics with Onsemi today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the drive electronics, making it resistant to environmental factors and impact.

Surface Mount: YES

Being surface mountable makes it easy to integrate this drive electronics into various systems and circuit boards, saving space and allowing for efficient assembly.

Package Shape: RECTANGULAR

The rectangular shape allows for a compact design, making it suitable for applications where space is limited.

Power Supplies (V): 5,12

Having multiple power supply options gives flexibility in choosing the appropriate voltage for different operational requirements.

No. of Terminals: 24

With a higher number of terminals, this product offers more connectivity options and the ability to interface with a variety of external devices.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the circuit board, allowing for efficient use of real estate in electronic designs.

Terminal Finish: Tin/Lead (Sn/Pb)

The tin/lead terminal finish provides good solderability and ensures reliable connections for long-term use.

Terminal Position: DUAL

Having dual terminal positions allows for better routing of connections on the circuit board, optimizing signal paths and reducing interference.

Technology: BIPOLAR

Bipolar technology offers high-speed performance and precise control in drive electronics applications, suitable for demanding requirements.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical strength and reliability during assembly and operation, ensuring secure connections.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch allows for fine pitch connections, enabling high-density mounting and enhancing overall design flexibility.

Technical Specifications

Drive Electronics CS-541D24 attributes and parameters. Explore more Drive Electronics devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e0

No. of Terminals:

24

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP24,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5,12

Qualification:

Not Qualified

Sub-Category:

Drive Electronics

Surface Mount:

YES

Technology:

BIPOLAR

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

CS-541D24 Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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