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CS-541N24

Onsemi

CS-541N24 by Onsemi

CS-541N24 by Onsemi is a 24-terminal drive electronics component with power supplies of 5V and 12V. Its package style is in-line, made of plastic/epoxy material, suitable for bipolar technology applications. The terminals are tin/lead finished with a pitch of 2.54mm, ideal for through-hole mounting in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,961 parts In-Stock

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1,961

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Digiode

USA . 912 parts In-Stock

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912

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 178 parts In-Stock

1+ parts

$5.215

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178

$5.215

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TANS Electronics

Latvia . 6,512 parts In-Stock

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6,512

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Kulean Microsystems

USA . 6,429 parts In-Stock

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6,429

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Northwest PG Solutions

USA . 1,818 parts In-Stock

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$5.111

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1,818

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$5.111

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Corphita

USA . 1,661 parts In-Stock

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1,661

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Problanco Electronics

Mexico . 1,630 parts In-Stock

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1,630

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SupplyDigital Components

Austria . 637 parts In-Stock

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637

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Corohmni

South Africa . 484 parts In-Stock

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484

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UHIMA Technologies

Türkiye . 204 parts In-Stock

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204

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Overview

Discover the power of reliable drive electronics with the CS-541N24 by Onsemi. Crafted with precision and expertise, this product offers unparalleled quality and performance in a compact rectangular package. Ideal for various applications, this versatile component provides power supplies of 5 and 12 volts, with 24 terminals for seamless connectivity. With a durable plastic/epoxy body and dual terminal position, the CS-541N24 ensures stability and efficiency in your electronic projects. Trust Onsemi to deliver exceptional value and benefits, making this product a must-have for all your drive electronics needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for use in various electronic applications.

Package Shape: RECTANGULAR

The rectangular shape allows for easy integration into electronic systems and provides a compact design for space-saving solutions.

Power Supplies (V): 5,12

The product supports multiple power supply options, offering flexibility in various electrical configurations and compatibility with different systems.

No. of Terminals: 24

With 24 terminals, the product can accommodate various connections, making it versatile and suitable for complex electronic setups.

Package Style (Meter): IN-LINE

The in-line package style makes installation and connection straightforward, ensuring ease of use and efficient integration into systems.

Terminal Finish: Tin/Lead (Sn/Pb)

The tin/lead terminal finish provides good conductivity and solderability, enhancing the product's performance and reliability in electronic circuits.

Terminal Position: DUAL

The dual terminal position allows for multiple connection options, offering versatility and accommodating different wiring configurations for increased compatibility.

Technology: BIPOLAR

The bipolar technology used in the product ensures stable and consistent performance, making it a reliable choice for various electronic applications.

Terminal Form: THROUGH-HOLE

The through-hole terminal form enables secure connections and easy soldering, ensuring a strong and reliable electrical connection in electronic assemblies.

Terminal Pitch: 2.54 mm

The 2.54 mm terminal pitch allows for precise alignment and spacing of terminals, reducing the risk of short circuits and ensuring proper connections in electronic circuits.

Technical Specifications

Drive Electronics CS-541N24 attributes and parameters. Explore more Drive Electronics devices from Onsemi

Specs

JESD-30 Code:

R-PDIP-T24

JESD-609 Code:

e0

No. of Terminals:

24

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP24,.6

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5,12

Qualification:

Not Qualified

Sub-Category:

Drive Electronics

Surface Mount:

NO

Technology:

BIPOLAR

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

CS-541N24 Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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