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CS-570FN28

Onsemi

CS-570FN28 by Onsemi

CS-570FN28 by Onsemi is a Drive Electronics chip carrier with 28 terminals, operating at 0-70 °C. It features 2 channels, bipolar technology, and supports power supplies of 5V and 12V. Ideal for surface mount applications in commercial-grade temperature environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 684 parts In-Stock

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684

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Vyrian

USA . 611 parts In-Stock

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611

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Distributors (Availability)

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Native Components

USA . 213 parts In-Stock

1+ parts

$0.317

100+ parts

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$0.304

213

$0.317

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$0.304

Northwest PG Solutions

USA . 343 parts In-Stock

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$0.348

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$0.307

343

$0.348

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$0.307

SupplyDigital Components

Austria . 6,749 parts In-Stock

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6,749

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Kulean Microsystems

USA . 5,744 parts In-Stock

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5,744

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Problanco Electronics

Mexico . 4,633 parts In-Stock

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4,633

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TANS Electronics

Latvia . 4,481 parts In-Stock

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4,481

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UHIMA Technologies

Türkiye . 852 parts In-Stock

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852

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Corphita

USA . 499 parts In-Stock

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499

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Corohmni

South Africa . 132 parts In-Stock

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Overview

Elevate your electronics game with the CS-570FN28 by Onsemi. Crafted with precision and expertise, this drive electronics module offers unparalleled quality and reliability. Whether you're looking to power up your next project or enhance existing systems, this product delivers exceptional performance and versatility. With its advanced technology and innovative design, the CS-570FN28 is the ideal choice for a wide range of applications. Experience the value and benefits that Onsemi brings to the table, and take your electronics to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the drive electronics, making it a reliable choice for long-term use.

Surface Mount: YES

Surface mount technology allows for easy installation and compact design, saving space and making the product suitable for various applications.

Package Shape: SQUARE

The square package shape provides stability and ease of mounting, ensuring secure placement in electronic systems.

Power Supplies (V): 5,12

The availability of multiple power supply options allows for flexibility in system design and compatibility with different power sources.

No. of Terminals: 28

The high number of terminals enables connectivity with other components, enhancing the functionality and versatility of the drive electronics.

Package Style (Meter): CHIP CARRIER

The chip carrier package style offers efficient heat dissipation and protection for the internal components, ensuring reliable performance under various conditions.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature tolerance ensures stable operation even in challenging environments, making the product suitable for industrial use.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature allows for reliable performance in cold conditions, expanding the range of applications for the drive electronics.

Terminal Finish: Tin/Lead (Sn/Pb)

The tin/lead terminal finish provides good conductivity and corrosion resistance, enhancing the durability and longevity of the drive electronics.

Temperature Grade: COMMERCIAL

The commercial temperature grade indicates that the drive electronics are designed for standard operating conditions, suitable for a wide range of commercial applications.

No. of Channels: 2

The presence of two channels allows for simultaneous operation or independent control of different functions, increasing the versatility and efficiency of the drive electronics.

Technology: BIPOLAR

The bipolar technology ensures high speed performance and accuracy, making the drive electronics ideal for applications that require precision and reliability.

Terminal Form: J BEND

The J bend terminal form facilitates easy soldering and secure connection, ensuring a stable electrical connection for the drive electronics.

Terminal Pitch: 1.27 mm

The small terminal pitch allows for compact design and efficient use of space, making the drive electronics suitable for miniaturized electronic systems.

Technical Specifications

Drive Electronics CS-570FN28 attributes and parameters. Explore more Drive Electronics devices from Onsemi

Specs

JESD-30 Code:

S-PQCC-J28

JESD-609 Code:

e0

No. of Channels:

2

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

5,12

Qualification:

Not Qualified

Sub-Category:

Drive Electronics

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Trade Compliance

CS-570FN28 Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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