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CS-514-2DW18

Onsemi

CS-514-2DW18 by Onsemi

CS-514-2DW18 by Onsemi is a Drive Electronics with 5V and 12V power supplies, 18 terminals, and dual terminal position. It uses bipolar technology in a small outline package for surface mount applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,885 parts In-Stock

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1,885

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Vyrian

USA . 1,093 parts In-Stock

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1,093

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 453 parts In-Stock

1+ parts

$0.365

100+ parts

-

1k+ parts

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$0.350

453

$0.365

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-

$0.350

Northwest PG Solutions

USA . 1,387 parts In-Stock

1+ parts

$0.402

100+ parts

-

1k+ parts

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10k+ parts

$0.354

1,387

$0.402

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$0.354

TANS Electronics

Latvia . 7,871 parts In-Stock

1+ parts

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7,871

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SupplyDigital Components

Austria . 6,402 parts In-Stock

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6,402

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Problanco Electronics

Mexico . 3,964 parts In-Stock

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3,964

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Kulean Microsystems

USA . 3,833 parts In-Stock

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3,833

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Corphita

USA . 2,126 parts In-Stock

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2,126

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UHIMA Technologies

Türkiye . 410 parts In-Stock

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410

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Corohmni

South Africa . 325 parts In-Stock

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325

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Overview

Enhance your electronic drive applications with the CS-514-2DW18 by Onsemi. Crafted with precision and quality, this drive electronics component offers unparalleled performance and reliability. With a reputation for excellence, Onsemi delivers products that exceed industry standards. Whether you're looking to power up your motor drives, industrial automation, or robotics systems, the CS-514-2DW18 provides the perfect solution. Trust in Onsemi to provide cutting-edge technology that simplifies your design process and ensures optimal functionality. Experience the value and benefits of this product today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is known for its durability and resistance to heat and chemicals, making it a reliable choice for electronic components.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation of the drive electronics onto circuit boards, saving time and effort in the manufacturing process.

Power Supplies (V): 5,12

The availability of multiple power supply options (5V and 12V) provides flexibility in design and compatibility with various systems and applications.

No. of Terminals: 18

Having 18 terminals allows for enhanced connectivity and functionalities, enabling the drive electronics to interface with multiple components and devices.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space and can be suitable for compact electronics designs without compromising on performance.

Technology: BIPOLAR

Bipolar technology offers reliability and stability in operation, ensuring consistent performance of the drive electronics over long periods of time.

Terminal Pitch: 1.27 mm

The fine terminal pitch of 1.27mm allows for fine-tuning and precise connections, enhancing the overall efficiency and performance of the drive electronics.

Technical Specifications

Drive Electronics CS-514-2DW18 attributes and parameters. Explore more Drive Electronics devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G18

JESD-609 Code:

e0

No. of Channels:

2

No. of Terminals:

18

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP18,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5,12

Qualification:

Not Qualified

Sub-Category:

Drive Electronics

Surface Mount:

YES

Technology:

BIPOLAR

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

CS-514-2DW18 Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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