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CS-117-4N22

Onsemi

CS-117-4N22 by Onsemi

CS-117-4N22 by Onsemi is a Drive Electronics with 4 channels and power supplies of 5V and 12V. It features a rectangular package style, dual terminal position, and through-hole technology. Ideal for applications requiring precise control in electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,917 parts In-Stock

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1,917

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Vyrian

USA . 1,349 parts In-Stock

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1,349

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

SupplyDigital Components

Austria . 7,941 parts In-Stock

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7,941

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Kulean Microsystems

USA . 7,292 parts In-Stock

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7,292

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Problanco Electronics

Mexico . 3,452 parts In-Stock

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3,452

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Corphita

USA . 1,876 parts In-Stock

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1,876

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TANS Electronics

Latvia . 1,592 parts In-Stock

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1,592

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Northwest PG Solutions

USA . 1,508 parts In-Stock

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1,508

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UHIMA Technologies

Türkiye . 966 parts In-Stock

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966

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Native Components

USA . 82 parts In-Stock

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82

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Corohmni

South Africa . 75 parts In-Stock

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75

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Overview

Experience unmatched performance and reliability with the CS-117-4N22 by Onsemi, a leading manufacturer in the industry. This drive electronics component offers seamless integration and versatility for a wide range of applications, providing customers with a competitive edge in their projects. With high-quality materials and advanced technology, this product delivers exceptional value and benefits, making it the perfect choice for all your electronic needs. Elevate your designs with Onsemi's CS-117-4N22 and unlock endless possibilities today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials are durable and resistant to heat, making this product suitable for various environments and conditions.

Package Shape: RECTANGULAR

Rectangular shape allows for easy integration and installation in electronic systems or equipment.

Power Supplies (V): 5,12

Support for multiple power supply voltages (5V and 12V) offers flexibility and compatibility with different devices or systems.

No. of Terminals: 22

Having a large number of terminals allows for more connections and functionalities, making this product versatile and suitable for complex applications.

Package Style (Meter): IN-LINE

The in-line package style is compact and space-saving, making it ideal for applications with limited space or where a sleek design is desired.

Terminal Finish: Tin/Lead (Sn/Pb)

Tin/lead terminal finish provides good conductivity and solderability, ensuring reliable connections and performance.

Terminal Position: DUAL

Dual terminal position allows for easier installation and wiring, reducing potential errors or complications during setup.

No. of Channels: 4

Having four channels provides options for multi-channel configurations or operations, offering increased functionality and performance.

Technology: BIPOLAR

Bipolar technology offers stable and precise operation, making this product suitable for applications requiring accurate signal processing or control.

Terminal Form: THROUGH-HOLE

Through-hole terminal form allows for secure and robust connections, making this product durable and suitable for applications with mechanical stress or vibrations.

Terminal Pitch: 2.54 mm

The 2.54mm terminal pitch is standard and widely used, offering compatibility and ease of integration with various electronic components or systems.

Technical Specifications

Drive Electronics CS-117-4N22 attributes and parameters. Explore more Drive Electronics devices from Onsemi

Specs

JESD-30 Code:

R-PDIP-T22

JESD-609 Code:

e0

No. of Channels:

4

No. of Terminals:

22

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP22,.4

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5,12

Qualification:

Not Qualified

Sub-Category:

Drive Electronics

Surface Mount:

NO

Technology:

BIPOLAR

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

CS-117-4N22 Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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