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CS-117-2N18

Onsemi

CS-117-2N18 by Onsemi

CS-117-2N18 by Onsemi is a Drive Electronics with 2 channels, operating at 5V and 12V. It features 18 terminals in an IN-LINE package style. This bipolar technology device with tin/lead finish is ideal for various electronic applications requiring precise power supply control.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,337 parts In-Stock

1+ parts

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2,337

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Digiode

USA . 531 parts In-Stock

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531

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 786 parts In-Stock

1+ parts

$0.224

100+ parts

-

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$0.215

786

$0.224

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-

$0.215

Northwest PG Solutions

USA . 1,859 parts In-Stock

1+ parts

$0.247

100+ parts

-

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$0.218

1,859

$0.247

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$0.218

Kulean Microsystems

USA . 5,202 parts In-Stock

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5,202

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TANS Electronics

Latvia . 5,160 parts In-Stock

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5,160

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Problanco Electronics

Mexico . 3,941 parts In-Stock

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3,941

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Corphita

USA . 1,446 parts In-Stock

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1,446

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SupplyDigital Components

Austria . 814 parts In-Stock

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814

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Corohmni

South Africa . 210 parts In-Stock

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210

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UHIMA Technologies

Türkiye . 143 parts In-Stock

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143

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Overview

Unleash the power of drive electronics with the CS-117-2N18 by Onsemi. Designed with superior quality and precision, this product offers unmatched reliability and performance. Whether you're looking to enhance your automotive systems, industrial machinery, or consumer electronics, this versatile component delivers seamless functionality and efficiency. With Onsemi's renowned expertise in semiconductor manufacturing, you can trust that the CS-117-2N18 will exceed your expectations. Elevate your projects with the value and benefits that only Onsemi can provide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLastic/Epoxy material provides good insulation and mechanical protection for the internal components, ensuring durability and reliability.

Package Shape: RECTANGULAR

Rectangular shape allows for easy integration into various electronic systems and provides a compact form factor.

Power Supplies (V): 5,12

Support for multiple power supply voltages makes this product versatile and compatible with a variety of systems.

No. of Terminals: 18

The ample number of terminals allow for easy connectivity and integration with other components in the system.

Package Style (Meter): IN-LINE

In-line package style enables space-saving installation and neat arrangement of components in the system.

Terminal Finish: Tin/Lead (Sn/Pb)

Tin/Lead terminal finish enhances solderability and ensures secure connections during installation.

Terminal Position: DUAL

Dual terminal position allows for increased flexibility in wiring and installation options.

No. of Channels: 2

Two channels provide the capability for dual functionality or redundancy in the system.

Technology: BIPOLAR

Bipolar technology offers reliable performance and precise control in driving electronic components.

Terminal Form: THROUGH-HOLE

Through-hole terminal form ensures secure mechanical mounting and easy soldering during installation.

Terminal Pitch: 2.54 mm

2.54 mm terminal pitch allows for standardization and compatibility with commonly used connectors and components.

Technical Specifications

Drive Electronics CS-117-2N18 attributes and parameters. Explore more Drive Electronics devices from Onsemi

Specs

JESD-30 Code:

R-PDIP-T18

JESD-609 Code:

e0

No. of Channels:

2

No. of Terminals:

18

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP18,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5,12

Qualification:

Not Qualified

Sub-Category:

Drive Electronics

Surface Mount:

NO

Technology:

BIPOLAR

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

CS-117-2N18 Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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