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CS-117-6RFN28

Onsemi

CS-117-6RFN28 by Onsemi

CS-117-6RFN28 by Onsemi is a 28-terminal drive electronics chip carrier with 6 channels. It operates at power supplies of 5V and 12V, using bipolar technology. The surface-mount square package is made of plastic/epoxy, ideal for various electronic applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 679 parts In-Stock

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679

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Digiode

USA . 476 parts In-Stock

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476

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 717 parts In-Stock

1+ parts

$0.466

100+ parts

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1k+ parts

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$0.447

717

$0.466

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$0.447

Northwest PG Solutions

USA . 565 parts In-Stock

1+ parts

$0.512

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1k+ parts

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$0.452

565

$0.512

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$0.452

SupplyDigital Components

Austria . 8,191 parts In-Stock

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8,191

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Kulean Microsystems

USA . 6,798 parts In-Stock

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6,798

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Problanco Electronics

Mexico . 5,935 parts In-Stock

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5,935

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TANS Electronics

Latvia . 4,365 parts In-Stock

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4,365

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Corphita

USA . 1,243 parts In-Stock

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1,243

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Corohmni

South Africa . 462 parts In-Stock

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462

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UHIMA Technologies

Türkiye . 387 parts In-Stock

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387

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Overview

Unleash the power of innovation with the CS-117-6RFN28 by Onsemi. As a leading manufacturer in drive electronics, Onsemi delivers unparalleled quality and reliability in every product. The CS-117-6RFN28 is perfect for a wide range of applications, offering customers the value of superior performance and efficiency. With six channels and advanced bipolar technology, this chip carrier package provides the ultimate solution for your electronic drive needs. Trust Onsemi to provide you with the cutting-edge technology you need to stay ahead in today's fast-paced world.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material provides durability and helps protect the internal components of the drive electronics, making it a reliable choice for long-term use.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on a circuit board, saving time and simplifying the assembly process.

Package Shape: SQUARE

The square package shape is space-efficient and allows for a compact design, making it suitable for applications where size is a constraint.

Power Supplies (V): 5,12

With power supplies options of 5V and 12V, this drive electronics product can be used in a variety of scenarios and applications, offering versatility.

No. of Terminals: 28

Having 28 terminals provides ample connectivity options, allowing for the integration of multiple components and peripherals, enhancing functionality.

Package Style (Meter): CHIP CARRIER

The chip carrier package style offers high-density integration capabilities, enabling the drive electronics to accommodate complex circuitry and signals.

Terminal Finish: Tin/Lead (Sn/Pb)

The tin/lead terminal finish ensures reliable electrical connections, minimizing the risk of signal interference and enhancing the overall performance of the product.

Terminal Position: QUAD

The quad terminal position layout simplifies the installation process and optimizes space usage on the circuit board, promoting efficiency and ease of integration.

No. of Channels: 6

With 6 channels available, this product can handle multiple signals simultaneously, providing flexibility and scalability in various applications.

Technology: BIPOLAR

The bipolar technology employed in this drive electronics product ensures reliable and stable performance, contributing to consistent operation and longevity.

Terminal Form: J BEND

The J bend terminal form facilitates soldering and improves the mechanical strength of the connections, enhancing the overall durability and robustness of the product.

Terminal Pitch: 1.27 mm

The 1.27mm terminal pitch offers precise positioning of the terminals, promoting proper alignment and reliable electrical connections, leading to improved signal integrity.

Technical Specifications

Drive Electronics CS-117-6RFN28 attributes and parameters. Explore more Drive Electronics devices from Onsemi

Specs

JESD-30 Code:

S-PQCC-J28

JESD-609 Code:

e0

No. of Channels:

6

No. of Terminals:

28

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

5,12

Qualification:

Not Qualified

Sub-Category:

Drive Electronics

Surface Mount:

YES

Technology:

BIPOLAR

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Trade Compliance

CS-117-6RFN28 Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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