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CS-3471N20

Onsemi

CS-3471N20 by Onsemi

CS-3471N20 by Onsemi is a Drive Electronics with 20 terminals, operating at 0-70 °C. It offers dual terminal position, 2 channels, and uses bipolar technology. Suitable for applications requiring power supplies of 5V and 12/24V in commercial temperature grade environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,476 parts In-Stock

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2,476

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Vyrian

USA . 1,861 parts In-Stock

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1,861

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 345 parts In-Stock

1+ parts

$7.916

100+ parts

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345

$7.916

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Northwest PG Solutions

USA . 147 parts In-Stock

1+ parts

$8.707

100+ parts

$7.836

1k+ parts

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147

$8.707

$7.836

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Problanco Electronics

Mexico . 7,955 parts In-Stock

1+ parts

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7,955

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SupplyDigital Components

Austria . 7,784 parts In-Stock

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7,784

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TANS Electronics

Latvia . 2,886 parts In-Stock

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2,886

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Kulean Microsystems

USA . 1,494 parts In-Stock

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1,494

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Corohmni

South Africa . 406 parts In-Stock

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406

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UHIMA Technologies

Türkiye . 91 parts In-Stock

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91

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Corphita

USA . 70 parts In-Stock

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70

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Overview

Upgrade your electronic devices with the CS-3471N20 by Onsemi, a high-quality drive electronics component that offers unparalleled performance and reliability. Manufactured by Onsemi, a trusted leader in semiconductor solutions, this product is perfect for a wide range of applications. With its innovative design and advanced technology, the CS-3471N20 provides customers with exceptional value, offering benefits such as enhanced efficiency, improved functionality, and increased durability. Trust Onsemi to deliver top-notch products that will elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the product lightweight and durable, ensuring long-term reliability.

Power Supplies (V): 5,12/24

The product can operate on multiple voltage supplies (5V, 12V, and 24V), providing flexibility and compatibility with different systems.

No. of Terminals: 20

Having 20 terminals allows for easy connectivity with other components, making the product versatile and suitable for various applications.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70 °C ensures stable performance even in challenging environments.

Technology: BIPOLAR

The use of bipolar technology provides accurate and reliable signal processing, making the product ideal for precision applications.

Maximum Supply Current: 90 mA

With a maximum supply current of 90 mA, the product consumes low power, making it energy-efficient and cost-effective.

Terminal Pitch: 2.54 mm

The 2.54 mm terminal pitch allows for easy installation and replacement, making the product user-friendly and maintenance-friendly.

Technical Specifications

Drive Electronics CS-3471N20 attributes and parameters. Explore more Drive Electronics devices from Onsemi

Specs

JESD-30 Code:

R-PDIP-T20

JESD-609 Code:

e0

No. of Channels:

2

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5,12/24

Qualification:

Not Qualified

Sub-Category:

Drive Electronics

Maximum Supply Current:

90 mA

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

CS-3471N20 Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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