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CS-117-2RDW18

Onsemi

CS-117-2RDW18 by Onsemi

CS-117-2RDW18 by Onsemi is a Drive Electronics with 2 channels, operating at 5V and 12V. It features a small outline package style, dual terminal position, and Gull Wing terminal form. Ideal for applications requiring bipolar technology in surface mount configurations.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,230 parts In-Stock

1+ parts

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2,230

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Vyrian

USA . 1,276 parts In-Stock

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1,276

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 837 parts In-Stock

1+ parts

$0.134

100+ parts

-

1k+ parts

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$0.129

837

$0.134

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-

$0.129

Northwest PG Solutions

USA . 1,401 parts In-Stock

1+ parts

$0.147

100+ parts

-

1k+ parts

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$0.130

1,401

$0.147

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-

$0.130

Problanco Electronics

Mexico . 7,666 parts In-Stock

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7,666

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Kulean Microsystems

USA . 5,973 parts In-Stock

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5,973

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TANS Electronics

Latvia . 4,633 parts In-Stock

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4,633

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SupplyDigital Components

Austria . 460 parts In-Stock

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460

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UHIMA Technologies

Türkiye . 403 parts In-Stock

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403

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Corohmni

South Africa . 391 parts In-Stock

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391

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Corphita

USA . 226 parts In-Stock

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226

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Overview

Enhance your electronic devices with the CS-117-2RDW18 by Onsemi, a top-quality drive electronics component that guarantees reliability and efficiency. Manufactured by Onsemi, a trusted name in the industry, this product offers unparalleled performance in various applications. With its advanced technology and user-friendly design, the CS-117-2RDW18 provides customers with exceptional value, benefits, and advantages. Upgrade your systems today with this superior drive electronics solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the drive electronics, ensuring a longer lifespan.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly onto circuit boards, saving time and space.

Power Supplies (V): 5,12

Having multiple power supply options gives flexibility in different applications and voltage requirements.

No. of Terminals: 18

With more terminals, there are more connection options available for integration into complex electronic systems.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the circuit board, allowing for more compact designs.

Terminal Finish: Tin/Lead (Sn/Pb)

The tin/lead finish provides excellent conductivity and solderability for reliable connections.

No. of Channels: 2

Having multiple channels allows for simultaneous operation or control of different functions, increasing versatility.

Technology: BIPOLAR

Bipolar technology offers high-speed performance and precise control in drive electronics applications.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy and secure soldering onto the circuit board, ensuring consistent connections.

Terminal Pitch: 1.27 mm

The small terminal pitch allows for dense packing of terminals on the circuit board, optimizing space usage.

Technical Specifications

Drive Electronics CS-117-2RDW18 attributes and parameters. Explore more Drive Electronics devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G18

JESD-609 Code:

e0

No. of Channels:

2

No. of Terminals:

18

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP18,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5,12

Qualification:

Not Qualified

Sub-Category:

Drive Electronics

Surface Mount:

YES

Technology:

BIPOLAR

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

CS-117-2RDW18 Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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