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CS-117-6RN28

Onsemi

CS-117-6RN28 by Onsemi

CS-117-6RN28 by Onsemi is a Drive Electronics with 6 channels, operating at 5V and 12V. It features a rectangular plastic/epoxy package with 28 terminals in an in-line style. This bipolar technology device has dual terminal position and tin/lead finish, suitable for various electronic applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 540 parts In-Stock

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540

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Digiode

USA . 491 parts In-Stock

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491

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 915 parts In-Stock

1+ parts

$0.369

100+ parts

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$0.354

915

$0.369

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$0.354

Northwest PG Solutions

USA . 976 parts In-Stock

1+ parts

$0.406

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$0.358

976

$0.406

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$0.358

Kulean Microsystems

USA . 3,547 parts In-Stock

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3,547

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SupplyDigital Components

Austria . 3,328 parts In-Stock

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3,328

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Problanco Electronics

Mexico . 2,958 parts In-Stock

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2,958

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TANS Electronics

Latvia . 2,252 parts In-Stock

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2,252

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Corphita

USA . 1,152 parts In-Stock

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Corohmni

South Africa . 438 parts In-Stock

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438

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UHIMA Technologies

Türkiye . 437 parts In-Stock

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437

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Overview

Unleash the power of precision with the CS-117-6RN28 by Onsemi. Crafted with unparalleled quality and expertise, this drive electronics marvel offers seamless integration and superior performance across a multitude of applications. Elevate your projects with ease and efficiency as you experience the value and benefits that this product brings to the table. Trust in Onsemi's reputation for excellence and innovation, and let the CS-117-6RN28 take your electronic endeavors to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good thermal and electrical insulation properties, making the product durable and reliable.

Package Shape: RECTANGULAR

The rectangular shape allows for easy integration and installation in various electronic systems.

Power Supplies (V): 5,12

The availability of multiple power supply options provides flexibility and compatibility with different systems.

No. of Terminals: 28

Having a high number of terminals allows for more connectivity options and functionality.

Package Style (Meter): IN-LINE

The in-line package style makes it easy to connect the product in a linear manner within a system.

Terminal Finish: Tin/Lead (Sn/Pb)

The tin/lead terminal finish ensures good solderability and corrosion resistance for long-term performance.

Terminal Position: DUAL

Having dual terminal positions provides redundancy and backup options for enhanced reliability.

No. of Channels: 6

The presence of multiple channels allows for multi-channel operation and versatile functionality.

Technology: BIPOLAR

Bipolar technology offers high-speed performance and precise control over the electronic signals.

Terminal Form: THROUGH-HOLE

The through-hole terminal form ensures strong mechanical connections and easy PCB mounting.

Terminal Pitch: 2.54 mm

With a standard terminal pitch of 2.54 mm, this product is compatible with a wide range of PCB layouts and designs.

Technical Specifications

Drive Electronics CS-117-6RN28 attributes and parameters. Explore more Drive Electronics devices from Onsemi

Specs

JESD-30 Code:

R-PDIP-T28

JESD-609 Code:

e0

No. of Channels:

6

No. of Terminals:

28

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP28,.6

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5,12

Qualification:

Not Qualified

Sub-Category:

Drive Electronics

Surface Mount:

NO

Technology:

BIPOLAR

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

CS-117-6RN28 Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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