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CS-510A-2DW18

Onsemi

CS-510A-2DW18 by Onsemi

CS-510A-2DW18 by Onsemi is a Drive Electronics with 2 channels, operating at 5V and 12V. It features a small outline package style, dual terminal position, and Gull Wing terminal form. Ideal for applications requiring bipolar technology in surface mount configurations.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,208 parts In-Stock

1+ parts

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1,208

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Digiode

USA . 810 parts In-Stock

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810

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 748 parts In-Stock

1+ parts

$0.093

100+ parts

-

1k+ parts

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10k+ parts

$0.089

748

$0.093

-

-

$0.089

Northwest PG Solutions

USA . 40 parts In-Stock

1+ parts

$0.102

100+ parts

-

1k+ parts

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10k+ parts

$0.090

40

$0.102

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-

$0.090

Kulean Microsystems

USA . 8,295 parts In-Stock

1+ parts

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8,295

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Problanco Electronics

Mexico . 5,989 parts In-Stock

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5,989

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TANS Electronics

Latvia . 4,003 parts In-Stock

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4,003

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SupplyDigital Components

Austria . 3,287 parts In-Stock

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3,287

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UHIMA Technologies

Türkiye . 334 parts In-Stock

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334

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Corphita

USA . 149 parts In-Stock

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149

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Corohmni

South Africa . 121 parts In-Stock

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121

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Overview

Enhance your electronic projects with the CS-510A-2DW18 by Onsemi. Known for their top-notch quality and reliability, Onsemi brings you this Drive Electronics component that is perfect for a wide range of applications. From power supplies to control circuits, this product offers exceptional value and benefits to customers seeking high-performance solutions. Trust Onsemi to deliver cutting-edge technology that will elevate your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to environmental factors, making this product suitable for various operating conditions.

Surface Mount: YES

Being surface mountable, this product can be easily integrated into circuit boards, saving space and simplifying assembly processes.

Power Supplies (V): 5,12

With multiple power supply options (5V and 12V), this product offers flexibility in design and compatibility with various systems.

No. of Terminals: 18

The higher number of terminals allows for more connectivity options and versatility in system integration.

Package Style (Meter): SMALL OUTLINE

The small outline package style helps in conserving space on the PCB and enables compact designs.

Terminal Finish: Tin/Lead (Sn/Pb)

The tin/lead terminal finish provides good conductivity and solderability, ensuring reliable connections in the circuit.

No. of Channels: 2

Having multiple channels (2 in this case) allows for independent control or processing of different signals, enhancing the functionality of the product.

Technology: BIPOLAR

The use of bipolar technology offers high performance, precision, and stability, making this product suitable for demanding applications.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical strength and ease of soldering during assembly, contributing to the product's reliability.

Terminal Pitch: 1.27 mm

The small terminal pitch of 1.27 mm allows for high-density mounting and fine-pitch connections, enabling compact and efficient circuit designs.

Technical Specifications

Drive Electronics CS-510A-2DW18 attributes and parameters. Explore more Drive Electronics devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G18

JESD-609 Code:

e0

No. of Channels:

2

No. of Terminals:

18

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP18,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5,12

Qualification:

Not Qualified

Sub-Category:

Drive Electronics

Surface Mount:

YES

Technology:

BIPOLAR

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

CS-510A-2DW18 Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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