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CS-511-8MRDW34

Onsemi

CS-511-8MRDW34 by Onsemi

CS-511-8MRDW34 by Onsemi is a Drive Electronics with 8 channels, operating at 5V and 12V. It features a small outline package style, dual terminal position, and gull wing terminal form. Ideal for applications requiring bipolar technology in surface mount configurations.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,356 parts In-Stock

1+ parts

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2,356

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Digiode

USA . 1,191 parts In-Stock

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1,191

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 303 parts In-Stock

1+ parts

$0.334

100+ parts

-

1k+ parts

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10k+ parts

$0.321

303

$0.334

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-

$0.321

Northwest PG Solutions

USA . 727 parts In-Stock

1+ parts

$0.368

100+ parts

-

1k+ parts

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10k+ parts

$0.324

727

$0.368

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-

$0.324

Kulean Microsystems

USA . 5,569 parts In-Stock

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5,569

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Problanco Electronics

Mexico . 3,981 parts In-Stock

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3,981

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TANS Electronics

Latvia . 3,785 parts In-Stock

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3,785

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Corphita

USA . 1,489 parts In-Stock

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1,489

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SupplyDigital Components

Austria . 476 parts In-Stock

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476

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UHIMA Technologies

Türkiye . 411 parts In-Stock

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411

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Corohmni

South Africa . 356 parts In-Stock

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356

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Overview

Enhance your electronic projects with the CS-511-8MRDW34 by Onsemi. Crafted with precision and expertise, this drive electronics module offers unparalleled quality and reliability. Perfect for a wide range of applications, this product boasts superior performance and efficiency. Experience seamless integration and optimal functionality with the CS-511-8MRDW34, designed to meet all your electronic needs. Upgrade your projects today with this cutting-edge solution from Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good insulation and heat dissipation, making the product durable and reliable.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on PCBs, saving space and reducing assembly time.

Package Shape: RECTANGULAR

Rectangular shape provides a compact design, which is ideal for space-constrained applications.

Power Supplies (V): 5,12

Support for multiple power supply voltages adds flexibility and compatibility with different systems.

No. of Terminals: 34

Having a high number of terminals allows for more connections and interfaces, enabling complex functionality.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the PCB, making it suitable for compact electronic devices.

Terminal Finish: Tin/Lead (Sn/Pb)

Tin/Lead terminal finish provides good solderability and reliability in various operating conditions.

Terminal Position: DUAL

Dual terminal position offers redundancy and improved signal integrity in communication and power delivery.

No. of Channels: 8

Having multiple channels allows for simultaneous processing of signals or data, enhancing performance and efficiency.

Technology: BIPOLAR

Bipolar technology ensures high-speed operation and precise control in driving electronics, delivering optimal performance.

Terminal Form: GULL WING

Gull wing terminal form provides secure mechanical support and easy assembly, improving overall product reliability.

Technical Specifications

Drive Electronics CS-511-8MRDW34 attributes and parameters. Explore more Drive Electronics devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G34

JESD-609 Code:

e0

No. of Channels:

8

No. of Terminals:

34

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP34(UNSPEC)

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5,12

Qualification:

Not Qualified

Sub-Category:

Drive Electronics

Surface Mount:

YES

Technology:

BIPOLAR

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Position:

DUAL

Trade Compliance

CS-511-8MRDW34 Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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