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CS-511-8RDW32

Onsemi

CS-511-8RDW32 by Onsemi

CS-511-8RDW32 by Onsemi is a Drive Electronics with 8 channels, operating at 5V and 12V. It features a small outline package style, dual terminal position, and gull wing form. This bipolar technology device has 32 terminals in a rectangular shape suitable for surface mount applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,494 parts In-Stock

1+ parts

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2,494

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Digiode

USA . 1,485 parts In-Stock

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1,485

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 755 parts In-Stock

1+ parts

$0.154

100+ parts

-

1k+ parts

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10k+ parts

$0.148

755

$0.154

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$0.148

Northwest PG Solutions

USA . 1,916 parts In-Stock

1+ parts

$0.169

100+ parts

-

1k+ parts

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$0.149

1,916

$0.169

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$0.149

SupplyDigital Components

Austria . 5,185 parts In-Stock

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5,185

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Kulean Microsystems

USA . 2,587 parts In-Stock

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2,587

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Corphita

USA . 1,629 parts In-Stock

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1,629

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Problanco Electronics

Mexico . 720 parts In-Stock

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720

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UHIMA Technologies

Türkiye . 516 parts In-Stock

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516

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Corohmni

South Africa . 355 parts In-Stock

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355

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TANS Electronics

Latvia . 184 parts In-Stock

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184

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Overview

Enhance your electronic projects with the CS-511-8RDW32 drive electronics by Onsemi. Designed with quality in mind, this product offers superior performance and reliability. With a focus on innovation and cutting-edge technology, Onsemi is a trusted manufacturer known for delivering top-notch products. Ideal for a wide range of applications, this drive electronics component provides value, benefits, and advantages that will take your projects to the next level. Upgrade your electronics with Onsemi's CS-511-8RDW32 and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and resistance to heat and moisture, making this product suitable for a variety of environments.

Surface Mount: YES

Surface mount technology allows for easy installation and saves space on the PCB, making the product more compact and efficient.

Package Shape: RECTANGULAR

Rectangular package shape ensures easy integration and alignment on the circuit board, enhancing overall functionality and usability.

Power Supplies (V): 5,12

Support for multiple power supply voltages (5V and 12V) allows for versatility in application and compatibility with different systems.

No. of Terminals: 32

Having 32 terminals provides ample connectivity options, enabling the product to interface with various devices and peripherals.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the PCB and improves overall system integration, making the product ideal for compact designs.

Terminal Finish: Tin/Lead (Sn/Pb)

Tin/Lead terminal finish ensures good electrical conductivity and solderability, enhancing the reliability and performance of the product.

Terminal Position: DUAL

Dual terminal position allows for better signal transmission and reduces the risk of signal interference, improving the product's overall signal integrity.

No. of Channels: 8

Having 8 channels provides the capability to handle multiple input and output signals simultaneously, making the product suitable for multi-channel applications.

Technology: BIPOLAR

Bipolar technology offers high-speed switching and low power consumption, enhancing the performance and efficiency of the product.

Terminal Form: GULL WING

Gull wing terminal form ensures secure connections and easy rework, making the product reliable and user-friendly during installation and maintenance.

Terminal Pitch: 1.27 mm

Having a terminal pitch of 1.27mm enables precise soldering and alignment on the PCB, ensuring a stable and robust connection for the product.

Technical Specifications

Drive Electronics CS-511-8RDW32 attributes and parameters. Explore more Drive Electronics devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G32

JESD-609 Code:

e0

No. of Channels:

8

No. of Terminals:

32

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP32,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5,12

Qualification:

Not Qualified

Sub-Category:

Drive Electronics

Surface Mount:

YES

Technology:

BIPOLAR

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

CS-511-8RDW32 Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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