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DP84910VHG-50

Texas Instruments

DP84910VHG-50 by Texas Instruments

DP84910VHG-50 by Texas Instruments is a drive electronics IC with 80 terminals, operating at 0-70°C. It has a supply voltage range of 4.5-5.5 V and max current of 220 mA. Ideal for read channel interface applications due to its low profile flatpack design with fine pitch terminals.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,428 parts In-Stock

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Digiode

USA . 5,333 parts In-Stock

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5,333

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Anansix

USA . 2,813 parts In-Stock

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Prism Electronics

USA . 68 parts In-Stock

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Northwest PG Solutions

USA . 1,206 parts In-Stock

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$2.835

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$2.835

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Parana Technologies

USA . 2,036 parts In-Stock

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$5.839

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$6.623

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2,036

$5.839

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$6.623

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DigiPath Technology Company

USA . 2,361 parts In-Stock

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$6.430

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2,361

$6.430

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ChromeModa Solutions

Germany . 4,841 parts In-Stock

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$6.561

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$5.380

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$6.561

$5.380

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IDEA Electronic Components Group

UK . 1,812 parts In-Stock

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$6.561

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$5.905

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One Stop Electronics

USA . 1,512 parts In-Stock

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$11.500

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$11.500

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AZTECH Wire

Italy . 639 parts In-Stock

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$17.755

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Corphita

USA . 3,141 parts In-Stock

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Native Components

USA . 459 parts In-Stock

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$2.500

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Perfect Parts

USA . 76 parts In-Stock

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Overview

Texas Instruments has revolutionized the Drive Electronics category with the DP84910VHG-50. With a commitment to quality and innovation, Texas Instruments delivers a product that exceeds expectations. This versatile device is not only easy to integrate thanks to its surface mount capability and low profile package style, but also offers reliable performance with a wide supply voltage range. Whether you're in need of drive electronics for consumer electronics, industrial applications or automotive systems, the DP84910VHG-50 provides unparalleled value and efficiency. Elevate your projects with Texas Instruments today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials provide durability and protection for the drive electronics, ensuring longevity and reliability.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation onto circuit boards, reducing assembly time and complexity.

Maximum Supply Voltage: 5.5 V

Higher maximum supply voltage allows for flexibility in power input, accommodating various system requirements.

Package Shape: SQUARE

Square shape of the package enables compact and efficient placement within electronic devices, optimizing space usage.

Power Supplies (V): 5

Stable power supply of 5V ensures consistent performance and functionality of the drive electronics.

No. of Terminals: 80

Abundance of terminals allows for versatile connectivity options, supporting multiple input and output connections.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Flatpack, low profile, and fine pitch package style enhances compatibility with modern electronic systems, facilitating integration and operation.

Minimum Supply Voltage: 4.5 V

Lower minimum supply voltage ensures that the drive electronics can operate efficiently even under less optimal power conditions.

Maximum Operating Temperature: 70 °C

High maximum operating temperature tolerance enables the drive electronics to function reliably in various environmental conditions.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature threshold ensures the drive electronics can start up and operate effectively even in cold environments.

Terminal Finish: TIN LEAD

Tin lead terminal finish enhances conductivity and corrosion resistance, ensuring stable and reliable electrical connections.

Terminal Position: QUAD

Quad terminal position enables efficient layout and organization of the terminals, optimizing space usage and ease of connectivity.

Maximum Seated Height: 1.5 mm

Low maximum seated height allows for compact and sleek design of the drive electronics, contributing to overall product aesthetics.

Width: 12 mm

Narrow width of 12mm facilitates seamless integration of the drive electronics into electronic devices with limited space availability.

Length: 12 mm

Compact length of 12mm ensures the drive electronics can fit snugly into various electronic applications without occupying excess space.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures the drive electronics are suitable for standard operating conditions typically encountered in commercial applications.

Terminal Form: GULL WING

Gull wing terminal form provides mechanical strength and stability to the drive electronics, minimizing the risk of damage during handling and installation.

Maximum Supply Current: 220 mA

Large maximum supply current capability allows the drive electronics to power demanding components and peripherals without risk of overload or malfunction.

Nominal Supply Voltage: 5 V

Standard nominal supply voltage of 5V ensures compatibility with common power sources, simplifying integration and operation.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm enables precise and secure connections, reducing the risk of signal interference or loss.

Interface IC Type: READ CHANNEL

Read channel interface IC type provides optimized data reading and processing capabilities, enhancing the performance and efficiency of the drive electronics.

Technical Specifications

Drive Electronics DP84910VHG-50 attributes and parameters. Explore more Drive Electronics devices from Texas Instruments

Specs

Interface IC Type:

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e0

Length:

12 mm

No. of Functions:

1

No. of Terminals:

80

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.55SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.5 mm

Sub-Category:

Drive Electronics

Maximum Supply Current:

220 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

12 mm

Trade Compliance

DP84910VHG-50 Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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