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TLS24306

Texas Instruments

TLS24306 by Texas Instruments

The Texas Instruments TLS24306 is a BICMOS drive electronics IC with 6 channels, operating at 5V. With a max supply current of 62mA and small outline package style, it's ideal for commercial applications requiring precise control in the temperature range of 0-70°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,079 parts In-Stock

1+ parts

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8,079

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Digiode

USA . 4,642 parts In-Stock

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4,642

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Prism Electronics

USA . 50 parts In-Stock

1+ parts

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50

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,088 parts In-Stock

1+ parts

$8.500

100+ parts

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1,088

$8.500

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Parana Technologies

USA . 371 parts In-Stock

1+ parts

$11.841

100+ parts

-

1k+ parts

$12.242

10k+ parts

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371

$11.841

-

$12.242

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DigiPath Technology Company

USA . 116 parts In-Stock

1+ parts

$13.039

100+ parts

-

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116

$13.039

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ChromeModa Solutions

Germany . 1,561 parts In-Stock

1+ parts

$13.305

100+ parts

$10.910

1k+ parts

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1,561

$13.305

$10.910

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IDEA Electronic Components Group

UK . 279 parts In-Stock

1+ parts

$13.305

100+ parts

$12.640

1k+ parts

$11.974

10k+ parts

-

279

$13.305

$12.640

$11.974

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AZTECH Wire

Italy . 369 parts In-Stock

1+ parts

$17.145

100+ parts

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369

$17.145

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Corphita

USA . 326 parts In-Stock

1+ parts

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326

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Perfect Parts

USA . 93 parts In-Stock

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93

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Overview

Enhance your electronic projects with the Texas Instruments TLS24306 Drive Electronics module, known for its superior quality and reliable performance. Manufactured by Texas Instruments, a leading name in the industry, this product offers unparalleled value and benefits for customers. With 6 channels and a nominal supply voltage of 5V, this versatile module is perfect for a wide range of applications. Whether you're working on robotics, automation, or any other project requiring precise control, the TLS24306 is the ideal solution to take your designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material provides a durable and lightweight package for this product, making it suitable for various applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation of this product onto circuit boards, saving time and effort during assembly.

Power Supplies (V): 5

With a power supply of 5V, this product is compatible with many standard electronic devices and systems, making it versatile and widely applicable.

No. of Terminals: 38

Having 38 terminals allows for complex connectivity and interface options, increasing the flexibility and capability of this product.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70°C ensures the reliability and stability of this product even under challenging environmental conditions.

No. of Channels: 6

Having 6 channels allows for multiple input/output connections, enhancing the functionality and performance of this product.

Technology: BICMOS

Utilizing BICMOS technology ensures a balance between high-performance CMOS and low-power bipolar circuits, making this product efficient and capable.

Maximum Supply Current: 62 mA

The maximum supply current of 62mA indicates the power efficiency of this product, consuming minimal energy while providing reliable operation.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5V is a standard and widely used power level, ensuring compatibility with various electronic systems and devices.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5mm allows for compact and space-saving installation of this product, ideal for devices with limited PCB real estate.

Technical Specifications

Drive Electronics TLS24306 attributes and parameters. Explore more Drive Electronics devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G38

No. of Channels:

6

No. of Terminals:

38

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP38,.25,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Drive Electronics

Maximum Supply Current:

62 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Trade Compliance

TLS24306 Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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