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L6326

STMicroelectronics

L6326 by STMicroelectronics

L6326 by STMicroelectronics is a dual-channel read/write amplifier circuit designed for Winchester drives. It operates at nominal voltages of 5V and 8V, featuring a compact 24-terminal package with a thin profile. Ideal for drive electronics, it ensures efficient data handling in space-constrained applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,019 parts In-Stock

1+ parts

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3,019

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Anansix

USA . 1,687 parts In-Stock

1+ parts

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1,687

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Vyrian

USA . 1,071 parts In-Stock

1+ parts

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1,071

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,156 parts In-Stock

1+ parts

$9.829

100+ parts

-

1k+ parts

$8.846

10k+ parts

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2,156

$9.829

-

$8.846

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MKK Technologies

India . 140 parts In-Stock

1+ parts

$18.483

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140

$18.483

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DigiPath Technology Company

USA . 140 parts In-Stock

1+ parts

$18.483

100+ parts

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140

$18.483

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Corphita

USA . 2,505 parts In-Stock

1+ parts

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2,505

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Parana Technologies

USA . 934 parts In-Stock

1+ parts

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$11.752

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934

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$11.752

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Overview

Unlock unparalleled performance with the L6326 by STMicroelectronics, a leading name in drive electronics. This high-quality component enhances your designs with its compact, efficient architecture, perfect for a variety of applications from data storage to advanced communication systems. Experience superior reliability and ease of integration, ensuring your projects achieve optimal results while benefiting from ST's commitment to innovation and excellence. Elevate your technology today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material helps in protecting the internal components, making it reliable for long-term use.

Surface Mount: YES

Surface mount technology allows for a more compact design, facilitating efficient use of space on the circuit board.

Package Shape: RECTANGULAR

The rectangular shape provides stability and ease of placement on PCB, ensuring optimal performance in a variety of applications.

Power Supplies (V): 5, 8

With dual power supply options of 5V and 8V, it offers flexibility for various circuit designs, enhancing compatibility.

No. of Terminals: 24

A higher number of terminals allows for more complex functionalities and connections, making it suitable for sophisticated applications.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile make it an ideal choice for space-constrained designs without compromising performance.

Terminal Finish: TIN LEAD

Tin lead finish enhances solderability and reliability of connections, ensuring better performance during operation.

Terminal Position: DUAL

Dual terminal positioning provides flexibility in PCB layout, simplifying integration into diverse designs.

Maximum Seated Height: 1.2 mm

A low seated height allows for a compact assembly, making it particularly useful in low-profile devices.

Width: 4.4 mm

A narrow width allows efficient space utilization on the PCB, crucial for high-density applications.

Length: 7.8 mm

The moderate length strikes a balance between size and performance, fitting well in various design constraints.

No. of Channels: 2

With two channels, this product can handle multiple signals simultaneously, enhancing its functionality in applications.

Technology: BICMOS

BICMOS technology combines the benefits of bipolar and CMOS technologies, offering high speed and low power consumption.

Terminal Form: GULL WING

Gull wing terminals provide excellent solder joint strength and are ideal for automated assembly, ensuring high manufacturing quality.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5V means compatibility with standard components, making it easy to integrate into existing systems.

Terminal Pitch: 0.65 mm

A small terminal pitch allows for denser packing of components, which is essential for modern electronic design.

Nominal Supply Voltage-1: 8 V

The 8V supply option provides versatility and is suitable for applications requiring higher voltage operation.

Interface IC Type: READ WRITE AMPLIFIER CIRCUIT

The read-write amplifier circuit interface is critical for data handling in storage applications, ensuring fast and reliable performance.

Drive Type: WINCHESTER

The Winchester drive type indicates high compatibility with hard disk drives, suitable for a wide range of storage solutions.

Technical Specifications

Drive Electronics L6326 attributes and parameters. Explore more Drive Electronics devices from STMicroelectronics

Specs

Drive Type:

WINCHESTER

Interface IC Type:

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e0

Length:

7.8 mm

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

24

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP24,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

5,8

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Drive Electronics

Nominal Supply Voltage:

5 V

Nominal Supply Voltage-1:

8 V

Surface Mount:

YES

Technology:

BICMOS

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

L6326 Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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