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CS-510A-4RDW24

Onsemi

CS-510A-4RDW24 by Onsemi

CS-510A-4RDW24 by Onsemi is a Drive Electronics with 4 channels, operating at 5V and 12V. It features a small outline package style, dual terminal position, and Gull Wing terminal form. Ideal for applications requiring bipolar technology and surface mount compatibility.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,180 parts In-Stock

1+ parts

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2,180

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Digiode

USA . 2,172 parts In-Stock

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2,172

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 773 parts In-Stock

1+ parts

$0.204

100+ parts

-

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$0.195

773

$0.204

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$0.195

Northwest PG Solutions

USA . 1,324 parts In-Stock

1+ parts

$0.224

100+ parts

-

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$0.197

1,324

$0.224

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$0.197

Problanco Electronics

Mexico . 8,016 parts In-Stock

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8,016

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Kulean Microsystems

USA . 6,151 parts In-Stock

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6,151

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SupplyDigital Components

Austria . 5,483 parts In-Stock

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5,483

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TANS Electronics

Latvia . 3,520 parts In-Stock

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3,520

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Corphita

USA . 2,185 parts In-Stock

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2,185

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UHIMA Technologies

Türkiye . 520 parts In-Stock

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520

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Corohmni

South Africa . 166 parts In-Stock

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166

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Overview

Enhance your electronic projects with the CS-510A-4RDW24 by Onsemi, a high-quality drive electronics component that offers reliable performance and versatility. Manufactured by Onsemi, a trusted name in the industry, this product is perfect for a wide range of applications. With its small outline package style and 24 terminals, this drive electronics module provides superior power supplies at 5V and 12V, with 4 channels for added flexibility. Experience the value and benefits of the CS-510A-4RDW24 and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection, making the product suitable for various environments.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation onto circuit boards.

Package Shape: RECTANGULAR

Rectangular shape enables compact and space-saving design, ideal for applications with limited space.

Power Supplies (V): 5,12

Support for multiple power supply options (5V, 12V) provides flexibility for different system requirements.

No. of Terminals: 24

A higher number of terminals allow for more connectivity options and functionalities within the product.

Package Style (Meter): SMALL OUTLINE

Small outline package style helps in reducing overall size and weight of the product, making it suitable for portable devices.

Terminal Finish: Tin/Lead (Sn/Pb)

Tin/Lead terminal finish ensures good conductivity and solderability, enhancing the performance and reliability of the product.

Terminal Position: DUAL

Dual terminal position offers redundancy and improves signal integrity, making the product more robust and reliable.

No. of Channels: 4

Four channels enable multi-channel functionality, allowing for simultaneous processing of multiple signals or data streams.

Technology: BIPOLAR

Bipolar technology offers good linear performance and high-speed operation, making the product suitable for high-frequency applications.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy soldering and mounting, ensuring efficient assembly and reliability of the product.

Terminal Pitch: 1.27 mm

Fine terminal pitch of 1.27 mm enables high-density mounting, allowing for more components to be accommodated within a limited space.

Technical Specifications

Drive Electronics CS-510A-4RDW24 attributes and parameters. Explore more Drive Electronics devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e0

No. of Channels:

4

No. of Terminals:

24

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP24,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5,12

Qualification:

Not Qualified

Sub-Category:

Drive Electronics

Surface Mount:

YES

Technology:

BIPOLAR

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

CS-510A-4RDW24 Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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