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L6332

STMicroelectronics

L6332 by STMicroelectronics

L6332 by STMicroelectronics is a compact drive IC featuring a 4-channel read/write amplifier circuit, ideal for Winchester drives. It operates at ±5V with a small outline package measuring just 9.7mm x 4.4mm and has a max height of 1.2mm. Its BICMOS technology ensures efficient performance in data storage applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,434 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,434

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-

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Anansix

USA . 606 parts In-Stock

1+ parts

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100+ parts

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606

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Vyrian

USA . 511 parts In-Stock

1+ parts

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511

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 289 parts In-Stock

1+ parts

$5.602

100+ parts

-

1k+ parts

$5.042

10k+ parts

-

289

$5.602

-

$5.042

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MKK Technologies

India . 2,375 parts In-Stock

1+ parts

$10.534

100+ parts

-

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2,375

$10.534

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DigiPath Technology Company

USA . 2,375 parts In-Stock

1+ parts

$10.534

100+ parts

-

1k+ parts

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10k+ parts

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2,375

$10.534

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-

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Parana Technologies

USA . 1,019 parts In-Stock

1+ parts

-

100+ parts

$6.698

1k+ parts

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1,019

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$6.698

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Corphita

USA . 121 parts In-Stock

1+ parts

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121

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Overview

Elevate your designs with the L6332 from STMicroelectronics—a pinnacle of reliability in drive electronics. Engineered for precision and efficiency, this compact solution offers unmatched performance for read/write applications, ensuring seamless data management. With STMicroelectronics' legacy of innovation, customers benefit from superior quality and robust support, empowering you to deliver cutting-edge solutions that stand out in any market. Experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material ensures durability and protection against environmental factors, making the product suitable for various applications.

Surface Mount: YES

Surface mount technology allows for a smaller footprint on printed circuit boards, optimizing space and enabling modern, compact designs.

Package Shape: RECTANGULAR

The rectangular shape enhances fitting in typical PCB layouts, facilitating easier integration into designs.

Power Supplies (V): +-5

Dual supply voltage requirement (+5V and -5V) allows for versatile operation in a wide range of applications.

No. of Terminals: 38

With 38 terminals, this component can connect multiple signals, increasing functionality and interfacing options.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile design support high-density mounting on PCBs, beneficial for space-constrained applications.

Terminal Finish: TIN LEAD

Tin-lead finish provides excellent solderability and corrosion resistance, ensuring reliable connections over time.

Terminal Position: DUAL

Dual terminal positions enable versatile PCB layout hence easing the design process.

Maximum Seated Height: 1.2 mm

A low maximum height helps maintain a sleek profile in compact devices, contributing to overall design aesthetics.

Width: 4.4 mm

A narrow width supports placement in tight spaces, making it ideal for compact electronics.

Length: 9.7 mm

The optimal length allows for effective signal routing while still fitting within space-constrained areas.

No. of Channels: 4

Four channels provide the capability to process multiple data streams simultaneously, enhancing performance in applications.

Technology: BICMOS

BICMOS technology combines the advantages of both bipolar and CMOS technologies, offering high speed and low power consumption.

Terminal Form: GULL WING

Gull wing terminals enhance mechanical stability and facilitate easier soldering during assembly.

Nominal Supply Voltage: 5 V

Standard nominal voltage of 5V is widely used, allowing for easy integration with numerous electronic systems.

Nominal Negative Supply Voltage: -5 V

A negative voltage supply enables the device to operate effectively in configurations requiring bipolar power.

Terminal Pitch: 0.5 mm

A smaller terminal pitch allows for denser layouts, increasing the potential for more connections in limited space.

Interface IC Type: READ WRITE AMPLIFIER CIRCUIT

Designed specifically for read/write operations makes this IC ideal for storage devices, ensuring quick data access.

Drive Type: WINCHESTER

The Winchester drive type is well-known for its reliability and performance in hard disk drive applications.

Technical Specifications

Drive Electronics L6332 attributes and parameters. Explore more Drive Electronics devices from STMicroelectronics

Specs

Drive Type:

WINCHESTER

Interface IC Type:

JESD-30 Code:

R-PDSO-G38

JESD-609 Code:

e0

Length:

9.7 mm

Nominal Negative Supply Voltage:

-5 V

No. of Channels:

4

No. of Functions:

1

No. of Terminals:

38

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP38,.25,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

+-5

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Drive Electronics

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BICMOS

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

L6332 Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

4140-01-497-0105, 4140014970105

NIIN

014970105

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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