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CS-541FN28

Onsemi

CS-541FN28 by Onsemi

CS-541FN28 by Onsemi is a 28-terminal drive electronics chip carrier with bipolar technology. It operates at 5V and 12V, features tin/lead terminal finish, and J bend terminals. Ideal for surface mount applications requiring a square package shape in plastic/epoxy material.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,430 parts In-Stock

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1,430

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Digiode

USA . 1,427 parts In-Stock

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1,427

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Northwest PG Solutions

USA . 1,135 parts In-Stock

1+ parts

$2.739

100+ parts

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1,135

$2.739

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Problanco Electronics

Mexico . 7,203 parts In-Stock

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7,203

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Kulean Microsystems

USA . 6,660 parts In-Stock

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6,660

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TANS Electronics

Latvia . 2,190 parts In-Stock

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2,190

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SupplyDigital Components

Austria . 1,507 parts In-Stock

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1,507

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Corphita

USA . 1,101 parts In-Stock

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1,101

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UHIMA Technologies

Türkiye . 578 parts In-Stock

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578

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Corohmni

South Africa . 433 parts In-Stock

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433

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Native Components

USA . 357 parts In-Stock

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$2.415

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357

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$2.415

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Overview

Unlock the potential of your electronic devices with the CS-541FN28 by Onsemi. Known for its superior quality and reliability, Onsemi drives electronics to new heights with this innovative product. Ideal for a wide range of applications, this chip carrier offers power supplies of 5V and 12V, along with 28 terminals for seamless integration. Experience the value and benefits of Onsemi's expertise in drive electronics, providing customers with cutting-edge solutions that deliver exceptional performance and efficiency. Elevate your projects with the CS-541FN28 and see the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the drive electronics, making it suitable for various environments.

Surface Mount: YES

Being surface mountable makes it easy to integrate into circuit boards and reduces assembly time.

Package Shape: SQUARE

Square shape allows for efficient use of space on the circuit board, optimizing the layout.

Power Supplies (V): 5,12

Supporting multiple power supply voltages offers flexibility in different applications and systems.

No. of Terminals: 28

Having a high number of terminals allows for the connection of various components and peripherals, enhancing functionality.

Package Style (Meter): CHIP CARRIER

Chip carrier package style provides a compact and reliable housing for the drive electronics.

Terminal Finish: Tin/Lead (Sn/Pb)

Tin/Lead terminal finish ensures good conductivity and solderability, promoting stable connections.

Terminal Position: QUAD

Quad terminal position makes it easier to align and mount the drive electronics on the circuit board.

Technology: BIPOLAR

Bipolar technology offers fast switching speeds and precise control, suitable for high-performance applications.

Terminal Form: J BEND

J bend terminal form provides mechanical strength and ease of insertion during assembly.

Terminal Pitch: 1.27 mm

Close terminal pitch allows for high-density packaging and minimizes signal interference, improving overall performance.

Technical Specifications

Drive Electronics CS-541FN28 attributes and parameters. Explore more Drive Electronics devices from Onsemi

Specs

JESD-30 Code:

S-PQCC-J28

JESD-609 Code:

e0

No. of Terminals:

28

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

5,12

Qualification:

Not Qualified

Sub-Category:

Drive Electronics

Surface Mount:

YES

Technology:

BIPOLAR

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Trade Compliance

CS-541FN28 Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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