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CS-7204DW20

Onsemi

CS-7204DW20 by Onsemi

CS-7204DW20 by Onsemi is a 4-channel drive electronics with 5V power supply, operating from 0 to 70 °C. It features small outline package style, dual terminal position, and Gull Wing form. Ideal for applications requiring bipolar technology and surface mount compatibility.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,254 parts In-Stock

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1,254

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Digiode

USA . 319 parts In-Stock

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319

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 894 parts In-Stock

1+ parts

$0.371

100+ parts

-

1k+ parts

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$0.356

894

$0.371

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$0.356

Northwest PG Solutions

USA . 2,259 parts In-Stock

1+ parts

$0.408

100+ parts

-

1k+ parts

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$0.360

2,259

$0.408

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$0.360

Problanco Electronics

Mexico . 8,099 parts In-Stock

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8,099

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Kulean Microsystems

USA . 5,027 parts In-Stock

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5,027

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SupplyDigital Components

Austria . 3,189 parts In-Stock

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3,189

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TANS Electronics

Latvia . 1,866 parts In-Stock

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1,866

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UHIMA Technologies

Türkiye . 213 parts In-Stock

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213

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Corohmni

South Africa . 195 parts In-Stock

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195

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Corphita

USA . 107 parts In-Stock

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107

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Overview

Enhance your electronic projects with the CS-7204DW20 by Onsemi! Crafted with precision and quality, this drive electronics module is designed to elevate your applications to new heights. Onsemi, a renowned manufacturer in the industry, ensures top-notch performance and reliability. With 4 channels and a nominal supply voltage of 5V, this product offers unmatched value and benefits. Whether you're working on robotics, automation, or control systems, the CS-7204DW20 delivers the power and efficiency you need. Upgrade your projects today with this cutting-edge solution from Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material ensures durability and protection for the drive electronics, making it suitable for various environments.

Surface Mount: YES

Surface mount capability allows for easy installation and integration into different electronic systems.

Power Supplies (V): 5

Operating at a voltage of 5V provides compatibility with common power sources and ensures stable performance.

No. of Terminals: 20

Having 20 terminals allows for versatile connectivity options and enables the drive electronics to interface with multiple components.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, the drive electronics can handle moderate to high temperature environments efficiently.

Technology: BIPOLAR

BIPOLAR technology used in the drive electronics offers reliable performance and precise control over the channels.

Technical Specifications

Drive Electronics CS-7204DW20 attributes and parameters. Explore more Drive Electronics devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e0

No. of Channels:

4

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Drive Electronics

Maximum Supply Current:

70 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

CS-7204DW20 Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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