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LV8222W

Onsemi

LV8222W by Onsemi

LV8222W by Onsemi is a Drive Electronics IC with 3 channels, BICMOS technology, and CD motor driver interface. It operates b/w -20 to 85 °C with supply voltage range of 2.1V to 5.5V. Ideal for applications requiring low profile, fine pitch flatpack package style in plastic/epoxy material.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,265 parts In-Stock

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1,265

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Vyrian

USA . 768 parts In-Stock

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768

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Problanco Electronics

Mexico . 7,714 parts In-Stock

1+ parts

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7,714

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Kulean Microsystems

USA . 7,670 parts In-Stock

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7,670

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SupplyDigital Components

Austria . 5,467 parts In-Stock

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5,467

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Corphita

USA . 1,131 parts In-Stock

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1,131

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TANS Electronics

Latvia . 530 parts In-Stock

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530

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UHIMA Technologies

Türkiye . 293 parts In-Stock

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293

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Corohmni

South Africa . 159 parts In-Stock

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159

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Overview

Enhance your electronic devices with the LV8222W by Onsemi. As a leading manufacturer in drive electronics, Onsemi ensures top-notch quality and reliability in all their products. The LV8222W offers unmatched performance and efficiency, making it the perfect choice for a wide range of applications. With its innovative technology and advanced features, this CD motor driver provides exceptional value and benefits to customers looking to elevate their designs. Upgrade your projects with the LV8222W and experience superior functionality like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good protection and durability for the drive electronics, making it a reliable choice for long-term use.

No. of Channels: 3

Having 3 channels allows for flexibility in controlling different aspects of the drive system, making it suitable for various applications.

Technology: BICMOS

BICMOS technology offers a combination of high-speed performance and low power consumption, enhancing the efficiency and effectiveness of the drive electronics.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand demanding environments without overheating, ensuring reliable performance under tough conditions.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage allows for compatibility with different power sources, increasing the versatility of this drive electronics product.

Technical Specifications

Drive Electronics LV8222W attributes and parameters. Explore more Drive Electronics devices from Onsemi

Specs

Interface IC Type:

JESD-30 Code:

S-PQFP-G48

Length:

7 mm

No. of Channels:

3

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Maximum Seated Height:

1.7 mm

Maximum Supply Current:

2 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.1 V

Nominal Supply Voltage:

2.4 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Trade Compliance

LV8222W Interface ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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