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CPH3122-TL-E

Onsemi

CPH3122-TL-E by Onsemi

CPH3122-TL-E by Onsemi is a PNP BJT with 3A IC, 200 hFE, and 0.9W power dissipation. Ideal for surface mount applications, it operates up to 150 °C making it suitable for various electronic circuits requiring high current amplification in compact designs.

Median Price

$0.117

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 57,415 parts In-Stock

1+ parts

-

100+ parts

$0.126

1k+ parts

$0.105

10k+ parts

$0.093

57,415

-

$0.126

$0.105

$0.093

DigiKey

USA . 41,490 parts In-Stock

1+ parts

-

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$0.070

41,490

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$0.070

Flip Electronics (Authorized)

USA . 41,490 parts In-Stock

1+ parts

-

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41,490

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Verical

USA . 36,500 parts In-Stock

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$0.117

36,500

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$0.117

Chip1Stop

Japan . 20 parts In-Stock

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20

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Distributors (In-Stock)

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Digiode

USA . 1,291 parts In-Stock

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$0.103

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1,291

$0.103

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Vyrian

USA . 436 parts In-Stock

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$0.108

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436

$0.108

-

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Bristol Electronics

USA . 2,218 parts In-Stock

1+ parts

$0.420

100+ parts

$0.155

1k+ parts

$0.109

10k+ parts

-

2,218

$0.420

$0.155

$0.109

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Flip Electronics

USA . 41,490 parts In-Stock

1+ parts

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41,490

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-

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DigiKey Marketplace

USA . 36,500 parts In-Stock

1+ parts

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36,500

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Chip Stock

USA . 27,000 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 2,218 parts In-Stock

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2,218

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Dan-Mar Components

USA . 2,218 parts In-Stock

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2,218

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Distributors (Availability)

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Corphita

USA . 1,906 parts In-Stock

1+ parts

$0.097

100+ parts

-

1k+ parts

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10k+ parts

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1,906

$0.097

-

-

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Corohmni

South Africa . 78 parts In-Stock

1+ parts

$0.108

100+ parts

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78

$0.108

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Component Stockers USA

USA . 92,925 parts In-Stock

1+ parts

$0.110

100+ parts

$0.100

1k+ parts

$0.090

10k+ parts

$0.090

92,925

$0.110

$0.100

$0.090

$0.090

Native Components

USA . 193 parts In-Stock

1+ parts

$7.122

100+ parts

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193

$7.122

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Kepictronics

USA . 186,000 parts In-Stock

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186,000

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Metaverse IC Inc.

Canada . 90,000 parts In-Stock

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Continental Prestige Electronics

USA . 57,415 parts In-Stock

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$0.098

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57,415

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$0.098

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QUARKTWIN TECHNOLOGY LTD

USA . 28,818 parts In-Stock

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28,818

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Authorized Procurement Solutions

USA . 25,000 parts In-Stock

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Problanco Electronics

Mexico . 7,711 parts In-Stock

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7,711

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SupplyDigital Components

Austria . 7,031 parts In-Stock

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7,031

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Perfect Parts

USA . 6,720 parts In-Stock

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6,720

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Kulean Microsystems

USA . 5,057 parts In-Stock

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5,057

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TANS Electronics

Latvia . 3,342 parts In-Stock

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3,342

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A-Z Elektronik GmbH

Germany . 1,800 parts In-Stock

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1,800

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Northwest PG Solutions

USA . 1,555 parts In-Stock

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$6.980

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1,555

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$6.980

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Alle Elektronik GmbH

Germany . 1,200 parts In-Stock

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1,200

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UHIMA Technologies

Türkiye . 978 parts In-Stock

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978

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Overview

Enhance your electronic projects with the reliable and high-quality CPH3122-TL-E PNP Small Signal Bipolar Junction Transistor by Onsemi. Designed for single configuration applications, this surface mount transistor offers a maximum collector current of 3A and a minimum DC current gain of 200. With a maximum power dissipation of 0.9W and operating temperature of 150 °C, this transistor is perfect for a wide range of electronic applications. Trust Onsemi's expertise in manufacturing to deliver superior performance and durability. Upgrade your projects today with the CPH3122-TL-E and experience the unmatched value and benefits it provides.

Feature Benefit Bullets

Polarity or Channel Type: PNP

PNP transistors are commonly used for high-side switching applications and are suitable for use in circuits where the load is connected between the collector and the positive power supply.

Configuration: SINGLE

Single configuration simplifies circuit design and makes it easier to troubleshoot compared to multiple transistor configurations.

Surface Mount: YES

Surface mount packaging provides a compact and lightweight solution, making it suitable for applications where space is limited.

Maximum Power Dissipation (Abs): 0.9 W

With a maximum power dissipation of 0.9W, this transistor can handle moderate power levels, making it versatile for a range of applications.

Minimum DC Current Gain (hFE): 200

A high minimum DC current gain of 200 ensures stable and reliable performance in amplification circuits.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature of 150 °C allows for use in environments with elevated temperatures without compromising performance.

Maximum Collector Current (IC): 3 A

A maximum collector current of 3A enables the transistor to handle higher load currents, increasing its versatility in various applications.

Terminal Finish: TIN BISMUTH

Tin bismuth terminal finish provides good solderability and ensures reliable electrical connections during assembly.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds allows for efficient and reliable soldering during assembly processes.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260 °C, the transistor can withstand the high temperatures involved in the soldering process without damage.

Technical Specifications

Small Signal Bipolar Junction Transistors (BJT) CPH3122-TL-E attributes and parameters. Explore more Small Signal Bipolar Junction Transistors (BJT) devices from Onsemi

Specs

Maximum Collector Current (IC):

3 A

Configuration:

Minimum DC Current Gain (hFE):

200

JESD-609 Code:

e6

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

Maximum Operating Temperature:

150 Cel

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

PNP

Maximum Power Dissipation (Abs):

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

TIN BISMUTH

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

CPH3122-TL-E Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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