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2SJ650

Onsemi

2SJ650 by Onsemi

The Onsemi 2SJ650 is a P-CHANNEL Power FET with 60V DS Breakdown Voltage and 48A IDM. Ideal for SWITCHING applications, it features 0.205 ohm Drain-Source Resistance and ENHANCEMENT MODE operation. Its PLASTIC/EPOXY package with THROUGH-HOLE terminals makes it suitable for various electronic designs.

Median Price

$0.475

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 517,666 parts In-Stock

1+ parts

-

100+ parts

$0.475

1k+ parts

$0.395

10k+ parts

$0.352

517,666

-

$0.475

$0.395

$0.352

Verical

USA . 517,466 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.493

10k+ parts

$0.440

517,466

-

-

$0.493

$0.440

DigiKey

USA . 159 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.410

10k+ parts

-

159

-

-

$0.410

-

Distributors (In-Stock)

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Vyrian

USA . 2,065 parts In-Stock

1+ parts

$0.325

100+ parts

-

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2,065

$0.325

-

-

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Digiode

USA . 1,174 parts In-Stock

1+ parts

$0.370

100+ parts

-

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1,174

$0.370

-

-

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DigiKey Marketplace

USA . 159 parts In-Stock

1+ parts

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159

-

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Distributors (Availability)

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Corohmni

South Africa . 333 parts In-Stock

1+ parts

$0.325

100+ parts

-

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333

$0.325

-

-

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Corphita

USA . 1,747 parts In-Stock

1+ parts

$0.351

100+ parts

-

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1,747

$0.351

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Kulean Microsystems

USA . 7,265 parts In-Stock

1+ parts

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7,265

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TANS Electronics

Latvia . 4,097 parts In-Stock

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4,097

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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4,000

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SupplyDigital Components

Austria . 2,541 parts In-Stock

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2,541

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Kepictronics

USA . 1,438 parts In-Stock

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1,438

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Assy Fe

Spain . 1,438 parts In-Stock

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1,438

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Problanco Electronics

Mexico . 1,093 parts In-Stock

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Native Components

USA . 781 parts In-Stock

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781

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Northwest PG Solutions

USA . 368 parts In-Stock

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368

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Continental Prestige Electronics

USA . 159 parts In-Stock

1+ parts

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$0.358

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159

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$0.358

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UHIMA Technologies

Türkiye . 6 parts In-Stock

1+ parts

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6

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Overview

Unleash the power of innovation with the 2SJ650 by Onsemi! This high-quality P-CHANNEL Power FET offers unmatched performance and reliability for all your switching needs. Manufactured by industry leader Onsemi, this transistor boasts a single configuration with a built-in diode, making it perfect for a wide range of applications. With a maximum pulsed drain current of 48A and a minimum DS breakdown voltage of 60V, the 2SJ650 delivers unparalleled efficiency and durability. Upgrade your electronics today and experience the value and benefits of choosing Onsemi's cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Polarity or Channel Type: P-CHANNEL

Allows for efficient current flow and control, suitable for various switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies the circuit design as it already includes a diode, saving time and resources during implementation.

Transistor Application: SWITCHING

Specifically designed for switching applications, ensuring optimized performance in such scenarios.

Minimum DS Breakdown Voltage: 60 V

With a high breakdown voltage, the transistor can handle higher voltages, making it versatile for different power requirements.

Package Shape: RECTANGULAR

Compact and space-saving design, convenient for installations where space is limited.

Terminal Form: THROUGH-HOLE

Easily mountable on circuit boards, facilitating the assembly process.

Operating Mode: ENHANCEMENT MODE

Enhances efficiency and control over the transistor operation in various conditions.

Maximum Pulsed Drain Current (IDM): 48 A

Capable of handling high currents in short bursts, ideal for applications with periodic peak loads.

No. of Terminals: 3

Simplifies the connection process, reducing the chance of errors during installation.

Package Style (Meter): FLANGE MOUNT

Allows for secure mounting in place, suitable for stable and long-term usage.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Offers reliability and efficiency in operation, ensuring consistent performance over time.

Transistor Element Material: SILICON

Known for its durability and conductivity, ensuring stable performance under various conditions.

Terminal Finish: Tin/Copper/Silver/Nickel (Sn/Cu/Ag/Ni)

Provides corrosion resistance and good electrical conductivity, maintaining the long-term functionality of the terminals.

Maximum Drain Current (ID): 12 A

Suitable for applications requiring moderate current handling, ensuring proper functionality in various scenarios.

Maximum Drain-Source On Resistance: 0.205 ohm

Low On resistance minimizes power loss and heat generation, enhancing the overall efficiency of the product.

Terminal Position: SINGLE

Simplifies the connection process, reducing the chance of errors during installation.

Case Connection: ISOLATED

Provides protection against unwanted electrical contact, ensuring safe operation in diverse environments.

Technical Specifications

Power Field Effect Transistors (FET) 2SJ650 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (ID):

12 A

Maximum Drain-Source On Resistance:

.205 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

48 A

Surface Mount:

NO

Terminal Finish:

Tin/Copper/Silver/Nickel (Sn/Cu/Ag/Ni)

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

2SJ650 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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