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2SJ665-DL-1E

Onsemi

2SJ665-DL-1E by Onsemi

The Onsemi 2SJ665-DL-1E is a P-CHANNEL FET with 27A max drain current and 65W max power dissipation. Ideal for high-power applications, it operates at up to 150 °C, making it suitable for various industrial and automotive uses.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 1,801 parts In-Stock

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Vyrian

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Kulean Microsystems

USA . 5,249 parts In-Stock

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Problanco Electronics

Mexico . 3,045 parts In-Stock

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TANS Electronics

Latvia . 1,947 parts In-Stock

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SupplyDigital Components

Austria . 618 parts In-Stock

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Corohmni

South Africa . 399 parts In-Stock

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UHIMA Technologies

Türkiye . 190 parts In-Stock

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Corphita

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Northwest PG Solutions

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Native Components

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Overview

Discover the power of innovation with the 2SJ665-DL-1E by Onsemi. This P-CHANNEL Power Field Effect Transistor offers unparalleled performance and reliability, thanks to Onsemi's commitment to quality manufacturing. Ideal for a wide range of applications, this FET provides exceptional power dissipation and efficiency. With a maximum drain current of 27A and a maximum operating temperature of 150 °C, the 2SJ665-DL-1E is the perfect choice for your next project. Experience the difference with Onsemi's cutting-edge technology and elevate your designs to new heights.

Feature Benefit Bullets

Polarity or Channel Type: P-CHANNEL

P-channel FETs have lower on-resistance compared to N-channel FETs, making them efficient for power management applications.

Configuration: SINGLE

Single configuration FETs are easy to implement and suitable for simple switching applications.

Surface Mount: YES

Surface mount FETs save space on the PCB and are easier to assemble in modern electronics.

Maximum Drain Current (Abs): 27 A

High maximum drain current allows the FET to handle larger loads and better power handling capabilities.

Maximum Power Dissipation (Abs): 65 W

High power dissipation capability ensures the FET can handle high power applications without overheating.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFETs offer fast switching speeds, high input impedance, and low drive power requirements for efficient performance.

Maximum Operating Temperature: 150 °C

High maximum operating temperature allows the FET to operate reliably in demanding environmental conditions.

Terminal Finish: TIN

Tin terminal finish provides good solderability and corrosion resistance for long-term reliability.

Technical Specifications

Power Field Effect Transistors (FET) 2SJ665-DL-1E attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

27 A

Maximum Drain Current (ID):

27 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

Maximum Operating Temperature:

150 Cel

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

TIN

Trade Compliance

2SJ665-DL-1E Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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