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2SJ656

Onsemi

2SJ656 by Onsemi

The Onsemi 2SJ656 is a P-CHANNEL Power FET with 100V DS Breakdown Voltage, ideal for SWITCHING applications. Featuring a max IDM of 72A and ID of 18A, it has a low 0.104 ohm RDS(ON). This FLANGE MOUNT transistor in PLASTIC/EPOXY package is suitable for DEPLETION MODE operation.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 2,365 parts In-Stock

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Digiode

USA . 265 parts In-Stock

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265

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Native Components

USA . 622 parts In-Stock

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$0.743

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622

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Northwest PG Solutions

USA . 1,955 parts In-Stock

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$0.817

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$0.817

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Component Stockers USA

USA . 382 parts In-Stock

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$99.990

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382

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Metaverse IC Inc.

Canada . 56,986 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 27,957 parts In-Stock

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Kulean Microsystems

USA . 7,147 parts In-Stock

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TANS Electronics

Latvia . 7,107 parts In-Stock

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Problanco Electronics

Mexico . 6,496 parts In-Stock

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CPlus Electronics

USA . 4,893 parts In-Stock

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SupplyDigital Components

Austria . 3,984 parts In-Stock

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Corphita

USA . 1,415 parts In-Stock

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Corohmni

South Africa . 118 parts In-Stock

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UHIMA Technologies

Türkiye . 85 parts In-Stock

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Overview

Unlock the power of efficiency and reliability with the 2SJ656 by Onsemi. Crafted by a leading manufacturer in the industry, this P-Channel Power Field Effect Transistor offers unparalleled performance and durability for a wide range of switching applications. With a high DS Breakdown Voltage of 100V and a maximum Drain Current of 18A, this transistor ensures seamless operation in depletion mode. Trust in Onsemi's superior quality and innovation to elevate your projects to new heights of success with the 2SJ656.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and protection for the transistor, making it durable and reliable.

Polarity or Channel Type: P-CHANNEL

P-channel FETs typically have lower ON-resistance and better performance in certain circuits compared to N-channel FETs.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode helps protect the transistor from voltage spikes and reverse currents, improving its reliability in switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring efficient operation in on/off control of power circuits.

Minimum DS Breakdown Voltage: 100 V

With a high breakdown voltage, this FET can handle higher voltages without damage, making it suitable for various power applications.

Package Shape: RECTANGULAR

The rectangular shape allows for easy mounting and efficient use of space on circuit boards.

Operating Mode: DEPLETION MODE

Depletion mode FETs can conduct current when the gate-source voltage is zero, offering flexibility in circuit design and operation.

Maximum Pulsed Drain Current (IDM): 72 A

The high pulsed current capability makes this FET suitable for applications requiring short-duration high currents, such as motor control.

No. of Terminals: 3

Having 3 terminals allows for easy connection in circuits, providing flexibility in design and integration.

Package Style (Meter): FLANGE MOUNT

The flange mount package style provides mechanical stability and heat dissipation, ensuring reliable performance in various environments.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers good performance, low noise, and high switching speeds, making this FET suitable for demanding applications.

Transistor Element Material: SILICON

Silicon is a common and reliable material for transistor elements, ensuring stable and consistent performance over time.

Terminal Finish: Tin/Copper/Silver/Nickel (Sn/Cu/Ag/Ni)

The terminal finish provides good conductivity, corrosion resistance, and solderability, ensuring reliable connections in circuits.

Maximum Drain Current (ID): 18 A

With a high drain current rating, this FET can handle significant power loads, making it suitable for power switching applications.

Maximum Drain-Source On Resistance: 0.104 ohm

The low ON-resistance reduces power losses and improves efficiency in power circuits, making this FET an energy-efficient choice.

Terminal Position: SINGLE

Having a single terminal position simplifies the connection and mounting process, ensuring easy integration in circuits.

Case Connection: ISOLATED

Isolated case connection provides electrical insulation and prevents short circuits, ensuring safe and reliable operation in high-voltage applications.

Technical Specifications

Power Field Effect Transistors (FET) 2SJ656 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (ID):

18 A

Maximum Drain-Source On Resistance:

.104 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

DEPLETION MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

72 A

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Finish:

Tin/Copper/Silver/Nickel (Sn/Cu/Ag/Ni)

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

2SJ656 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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