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2SJ652

Onsemi

2SJ652 by Onsemi

The Onsemi 2SJ652 is a P-CHANNEL Power FET with 60V DS Breakdown Voltage and 112A IDM. Ideal for SWITCHING applications, it features 0.0555 ohm Drain-Source On Resistance and operates in DEPLETION MODE. The transistor has a RECTANGULAR package style with THROUGH-HOLE terminals, suitable for various power control systems.

Median Price

$2.320

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 20 parts In-Stock

1+ parts

-

100+ parts

$2.320

1k+ parts

$2.070

10k+ parts

$1.950

20

-

$2.320

$2.070

$1.950

Distributors (In-Stock)

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Digiode

USA . 916 parts In-Stock

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$2.451

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916

$2.451

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Vyrian

USA . 5,431 parts In-Stock

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5,431

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ACDS - Activité Composants Distribution Service

France . 900 parts In-Stock

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900

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Bristol Electronics

USA . 780 parts In-Stock

1+ parts

-

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$1.464

1k+ parts

$1.286

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780

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$1.464

$1.286

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Dan-Mar Components

USA . 780 parts In-Stock

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780

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Connector Distribution Corp

USA . 317 parts In-Stock

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317

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Right Parts Inc.

USA . 317 parts In-Stock

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317

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ECAB

Sweden . 10 parts In-Stock

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10

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Distributors (Availability)

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Andel Nordic

Denmark . 761 parts In-Stock

1+ parts

$1.660

100+ parts

-

1k+ parts

$1.164

10k+ parts

$1.164

761

$1.660

-

$1.164

$1.164

Corphita

USA . 1,230 parts In-Stock

1+ parts

$2.322

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1,230

$2.322

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Corohmni

South Africa . 106 parts In-Stock

1+ parts

$2.580

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106

$2.580

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Component Stockers USA

USA . 27 parts In-Stock

1+ parts

$2.620

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27

$2.620

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Metaverse IC Inc.

Canada . 56,986 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 24,416 parts In-Stock

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Kulean Microsystems

USA . 8,087 parts In-Stock

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8,087

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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SupplyDigital Components

Austria . 3,176 parts In-Stock

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3,176

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Glotronic Ltd.

UK . 2,780 parts In-Stock

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2,780

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Northwest PG Solutions

USA . 1,676 parts In-Stock

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1,676

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UHIMA Technologies

Türkiye . 857 parts In-Stock

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Problanco Electronics

Mexico . 842 parts In-Stock

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842

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Kepictronics

USA . 448 parts In-Stock

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448

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Futuretech Components

Singapore . 448 parts In-Stock

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448

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Native Components

USA . 411 parts In-Stock

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411

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TANS Electronics

Latvia . 289 parts In-Stock

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GreenTree Electronics

Israel . 50 parts In-Stock

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Perfect Parts

USA . 7 parts In-Stock

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7

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Overview

Elevate your power management solutions with the Onsemi 2SJ652 Power Field Effect Transistor. Designed with high-quality materials and cutting-edge technology, this P-CHANNEL transistor offers exceptional performance in switching applications. With a maximum drain current of 28A and a low on-resistance of 0.0555 ohm, this transistor delivers reliable and efficient operation. Whether you're looking to optimize energy efficiency or enhance system reliability, the 2SJ652 is the perfect choice for your next project. Experience the value and benefits of Onsemi's innovative products today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the transistor.

Polarity or Channel Type: P-CHANNEL

Allows for efficient current flow and control in the desired direction.

Minimum DS Breakdown Voltage: 60 V

Ensures the transistor can handle high voltage applications without breakdown.

Maximum Pulsed Drain Current (IDM): 112 A

High pulsed drain current capability allows for handling surges in power efficiently.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Utilizes advanced technology for improved performance and reliability.

Maximum Drain Current (ID): 28 A

Can handle high continuous drain current for sustained operation.

Maximum Drain-Source On Resistance: 0.0555 ohm

Low on resistance helps in minimizing power losses and improving efficiency.

Technical Specifications

Power Field Effect Transistors (FET) 2SJ652 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Case Connection:

ISOLATED

Configuration:

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (ID):

28 A

Maximum Drain-Source On Resistance:

.0555 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

DEPLETION MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

112 A

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Finish:

Tin/Copper/Silver/Nickel (Sn/Cu/Ag/Ni)

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

2SJ652 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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