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2SJ667

Onsemi

2SJ667 by Onsemi

The Onsemi 2SJ667 is a P-CHANNEL FET with 100V DS Breakdown Voltage, ideal for SWITCHING applications. Featuring a max IDM of 168A and EAS of 58mJ, it operates in ENHANCEMENT MODE. With 0.074 ohm RDS(on) and SILICON element material, it offers high performance in various power applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,830 parts In-Stock

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1,830

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Vyrian

USA . 516 parts In-Stock

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516

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Northwest PG Solutions

USA . 1,533 parts In-Stock

1+ parts

$2.888

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1,533

$2.888

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Problanco Electronics

Mexico . 7,000 parts In-Stock

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7,000

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Kulean Microsystems

USA . 6,766 parts In-Stock

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6,766

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SupplyDigital Components

Austria . 2,452 parts In-Stock

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2,452

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Corphita

USA . 1,442 parts In-Stock

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1,442

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TANS Electronics

Latvia . 1,345 parts In-Stock

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1,345

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Native Components

USA . 433 parts In-Stock

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$2.546

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433

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$2.546

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Corohmni

South Africa . 322 parts In-Stock

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UHIMA Technologies

Türkiye . 25 parts In-Stock

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Overview

Elevate your power systems with the 2SJ667 by Onsemi. Crafted with precision and expertise, this P-CHANNEL Power Field Effect Transistor offers unparalleled performance in switching applications. With a high DS Breakdown Voltage and maximum Drain Current, this transistor ensures efficiency and reliability in your circuits. Say goodbye to frequent replacements and hello to long-lasting durability. Trust Onsemi to deliver quality and innovation that exceeds expectations. Upgrade your designs today with the 2SJ667 for superior results every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body ensures durability and protection for the internal components of the FET.

Polarity or Channel Type: P-CHANNEL

P-channel FETs are known for their low on-resistance, making them efficient for switching applications.

Minimum DS Breakdown Voltage: 100 V

With a minimum breakdown voltage of 100 V, this FET is suitable for applications requiring high voltage handling capabilities.

Maximum Pulsed Drain Current (IDM): 168 A

The high pulsed drain current rating of 168 A allows for handling of high current spikes without damage to the FET.

Avalanche Energy Rating (EAS): 58 mJ

The high avalanche energy rating of 58 mJ indicates the FET's ability to withstand high energy transient events.

Maximum Drain Current (ID): 42 A

The maximum drain current rating of 42 A ensures efficient current handling capabilities for various applications.

Maximum Drain-Source On Resistance: 0.074 ohm

The low on-resistance of 0.074 ohm results in reduced power dissipation and improved efficiency during operation.

Technical Specifications

Power Field Effect Transistors (FET) 2SJ667 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

58 mJ

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (ID):

42 A

Maximum Drain-Source On Resistance:

.074 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

168 A

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Finish:

Tin/Copper/Silver/Nickel (Sn/Cu/Ag/Ni)

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

2SJ667 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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