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2SJ657

Onsemi

2SJ657 by Onsemi

The Onsemi 2SJ657 is a P-CHANNEL Power FET with 100V DS Breakdown Voltage, ideal for SWITCHING applications. Featuring a max IDM of 100A and ID of 25A, it has a low 0.069 ohm RDS(ON). The transistor comes in a RECTANGULAR package with THROUGH-HOLE terminals, suitable for ENHANCEMENT MODE operation.

Median Price

$1.100

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 1 parts In-Stock

1+ parts

$0.840

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-

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1

$0.840

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Rochester

USA . 65 parts In-Stock

1+ parts

-

100+ parts

$1.360

1k+ parts

$1.130

10k+ parts

$1.010

65

-

$1.360

$1.130

$1.010

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 268 parts In-Stock

1+ parts

$0.798

100+ parts

-

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268

$0.798

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Vyrian

USA . 3,614 parts In-Stock

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3,614

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LittleDiode

UK . 1 parts In-Stock

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1

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 11 parts In-Stock

1+ parts

$0.281

100+ parts

-

1k+ parts

-

10k+ parts

$0.270

11

$0.281

-

-

$0.270

Northwest PG Solutions

USA . 1,976 parts In-Stock

1+ parts

$0.309

100+ parts

-

1k+ parts

-

10k+ parts

$0.273

1,976

$0.309

-

-

$0.273

Corphita

USA . 139 parts In-Stock

1+ parts

$0.756

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-

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139

$0.756

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Corohmni

South Africa . 291 parts In-Stock

1+ parts

$0.840

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291

$0.840

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Kulean Microsystems

USA . 7,955 parts In-Stock

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7,955

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Problanco Electronics

Mexico . 5,527 parts In-Stock

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5,527

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TANS Electronics

Latvia . 5,481 parts In-Stock

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5,481

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SupplyDigital Components

Austria . 3,188 parts In-Stock

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3,188

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UHIMA Technologies

Türkiye . 129 parts In-Stock

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129

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Overview

Unleash the power of innovation with the 2SJ657 by Onsemi, a top-quality P-CHANNEL Power Field Effect Transistor designed for switching applications. Manufactured by Onsemi, a trusted leader in semiconductor technology, this transistor offers unparalleled performance and reliability. With a maximum drain current of 25A and a minimum DS breakdown voltage of 100V, this transistor is ideal for a wide range of applications. Upgrade your projects with the 2SJ657 and experience the benefits of enhanced efficiency and superior functionality. Elevate your designs with Onsemi's cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body provides durability and protection to the internal components of the FET, making it suitable for various environments and applications.

Polarity or Channel Type: P-CHANNEL

P-Channel FETs are known for their low conduction resistance and high efficiency, making them ideal for power management and switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode helps in protecting the FET from reverse currents and voltage spikes, ensuring reliable performance and enhancing the overall stability of the circuit.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers fast switching speeds and high current handling capabilities, making it suitable for various power control tasks.

Minimum DS Breakdown Voltage: 100 V

With a minimum breakdown voltage of 100V, this FET can handle high voltage applications with ease, providing a reliable and safe operation in voltage critical circuits.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy mounting and installation in a variety of circuit layouts, providing flexibility in design and space-saving benefits.

Terminal Form: THROUGH-HOLE

The through-hole terminal form ensures secure and reliable connections, making it easier for soldering and desoldering during assembly and maintenance procedures.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer easy control of the current flow in the circuit, allowing for efficient power management and improved overall performance of the system.

Technical Specifications

Power Field Effect Transistors (FET) 2SJ657 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (ID):

25 A

Maximum Drain-Source On Resistance:

.069 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

100 A

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Finish:

Tin/Copper/Silver/Nickel (Sn/Cu/Ag/Ni)

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

2SJ657 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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