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2N6667AS

Onsemi

2N6667AS by Onsemi

2N6667AS by Onsemi is a PNP power BJT with a min hFE of 100, max VCE of 60V, and max IC of 10A. Ideal for amplifier applications due to its Darlington configuration with built-in diode and resistor. Operates up to 150 °C, making it suitable for high-temperature environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 1,501 parts In-Stock

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1,501

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Digiode

USA . 1,395 parts In-Stock

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1,395

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Distributors (Availability)

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Native Components

USA . 517 parts In-Stock

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$129.990

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$124.790

517

$129.990

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$124.790

Northwest PG Solutions

USA . 1,797 parts In-Stock

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$142.989

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$142.989

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Problanco Electronics

Mexico . 5,055 parts In-Stock

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5,055

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TANS Electronics

Latvia . 4,157 parts In-Stock

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4,157

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SupplyDigital Components

Austria . 4,070 parts In-Stock

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4,070

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Corphita

USA . 1,593 parts In-Stock

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1,593

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UHIMA Technologies

Türkiye . 300 parts In-Stock

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300

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Corohmni

South Africa . 193 parts In-Stock

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Kulean Microsystems

USA . 141 parts In-Stock

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141

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Overview

Enhance your electronic projects with the reliable and high-quality 2N6667AS Power BJT from Onsemi. Known for their superior manufacturing standards, Onsemi delivers a product that guarantees excellent performance and durability. Ideal for amplifier applications, this PNP transistor offers a seamless integration into your designs. With a built-in diode and resistor, this transistor simplifies circuit design while providing a powerful boost to your projects. Trust Onsemi's expertise and choose the 2N6667AS for all your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation for safer operation and protection of internal components.

Polarity or Channel Type: PNP

Suitable for applications where PNP transistors are required, allowing for specific circuit design and functionality.

Configuration: DARLINGTON WITH BUILT-IN DIODE AND RESISTOR

Saves space and simplifies design with integrated components, providing convenience for circuit designers.

Transistor Application: AMPLIFIER

Designed for amplification applications, ensuring optimal performance in audio or signal amplification circuits.

Package Shape: RECTANGULAR

Easily mountable and fits well within circuit layouts, enhancing installation flexibility.

Terminal Form: THROUGH-HOLE

Provides strong mechanical connection for reliable performance and ease of soldering during assembly.

No. of Terminals: 3

Simplifies circuit connections and reduces the risk of wiring errors.

Package Style (Meter): FLANGE MOUNT

Allows for secure mounting in place, ensuring stability and consistent performance over time.

Minimum DC Current Gain (hFE): 100

Ensures consistent and reliable amplification of signals with high efficiency.

Maximum Operating Temperature: 150 °C

Capable of operating in high temperature environments without compromising performance, suitable for industrial applications.

Maximum Collector-Emitter Voltage: 60 V

Provides a high voltage threshold for reliable operation in various circuits without risk of breakdown.

Transistor Element Material: SILICON

Offers high performance and durability, ensuring long-term reliability in circuit applications.

Maximum Collector Current (IC): 10 A

Supports high current applications with efficient power handling capabilities, suitable for demanding circuit requirements.

Terminal Finish: TIN LEAD

Provides good conductivity and solderability, ensuring secure and lasting electrical connections.

Terminal Position: SINGLE

Simplifies circuit design and connection, reducing the risk of errors during assembly.

Case Connection: COLLECTOR

Clear indication of connection point for easy integration within circuits, facilitating circuit design and troubleshooting.

Technical Specifications

Power Bipolar Junction Transistors (BJT) 2N6667AS attributes and parameters. Explore more Power Bipolar Junction Transistors (BJT) devices from Onsemi

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

60 V

Minimum DC Current Gain (hFE):

100

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

PNP

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

2N6667AS Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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