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2N6667AN

Onsemi

2N6667AN by Onsemi

Onsemi 2N6667AN is a PNP BJT with Darlington configuration, hFE of 100, and IC of 10A. Ideal for amplifier applications, it has VCEO of 60V and operates up to 150 °C. Package style is flange mount with through-hole terminals in plastic/epoxy body.

Median Price

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Lifecycle Status

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2

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1k+

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Vyrian

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Digiode

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Kulean Microsystems

USA . 4,817 parts In-Stock

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Problanco Electronics

Mexico . 4,595 parts In-Stock

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TANS Electronics

Latvia . 3,357 parts In-Stock

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Northwest PG Solutions

USA . 2,119 parts In-Stock

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UHIMA Technologies

Türkiye . 795 parts In-Stock

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SupplyDigital Components

Austria . 752 parts In-Stock

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Corohmni

South Africa . 293 parts In-Stock

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Corphita

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Native Components

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Overview

Elevate your amplifier projects with the 2N6667AN by Onsemi, a top-quality Power Bipolar Junction Transistor (BJT) renowned for its reliability and performance. Manufactured by Onsemi, a trusted name in the industry, this PNP transistor features a DARLINGTON configuration with a built-in diode and resistor, making it perfect for amplifier applications. With a maximum Collector-Emitter Voltage of 60V and a maximum Collector Current of 10A, this transistor delivers exceptional value and benefits to customers seeking high-quality components for their electronic projects. Trust Onsemi and the 2N6667AN to take your amplifier designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the transistor lightweight and durable, making it suitable for various applications.

Polarity or Channel Type: PNP

The PNP configuration allows for easy integration into circuits that require PNP transistors, providing flexibility in design and implementation.

Configuration: DARLINGTON WITH BUILT-IN DIODE AND RESISTOR

The Darlington configuration with built-in diode and resistor enhances the performance and efficiency of the amplifier application, simplifying circuit design.

Transistor Application: AMPLIFIER

Designed specifically for amplifier applications, this transistor ensures high-quality amplification and signal processing.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy mounting and placement on circuit boards, saving space and improving overall circuit layout.

Terminal Form: THROUGH-HOLE

The through-hole terminal form simplifies the soldering process and provides a secure connection, ensuring reliable performance in various operating conditions.

No. of Terminals: 3

With three terminals, this transistor offers straightforward connectivity and compatibility with standard circuit configurations.

Package Style (Meter): FLANGE MOUNT

The flange mount package style allows for convenient mounting on heat sinks or other components, improving thermal management and overall performance.

Minimum DC Current Gain (hFE): 100

With a minimum DC current gain of 100, this transistor provides consistent amplification and signal processing capabilities in amplifier circuits.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature of 150 °C ensures reliable and stable performance even in challenging environments or under heavy loads.

Maximum Collector-Emitter Voltage: 60 V

With a high maximum collector-emitter voltage of 60V, this transistor can handle a wide range of voltage levels, making it versatile and reliable in various applications.

Transistor Element Material: SILICON

The silicon transistor element material ensures high performance, reliability, and efficiency, making it a durable and long-lasting component for amplifier circuits.

Maximum Collector Current (IC): 10 A

The high maximum collector current of 10A allows for robust and efficient operation, making this transistor suitable for high-power amplifier applications.

Terminal Finish: TIN LEAD

The tin lead terminal finish provides excellent solderability and conductivity, ensuring a reliable connection and enhancing overall performance.

Terminal Position: SINGLE

The single terminal position simplifies the connection process and ensures proper alignment, making installation and integration hassle-free.

Case Connection: COLLECTOR

The collector case connection enhances the efficiency and reliability of the transistor, ensuring optimal performance and minimal signal loss in amplifier applications.

Technical Specifications

Power Bipolar Junction Transistors (BJT) 2N6667AN attributes and parameters. Explore more Power Bipolar Junction Transistors (BJT) devices from Onsemi

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

60 V

Minimum DC Current Gain (hFE):

100

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

PNP

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

2N6667AN Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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