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CBTL04082BBS

NXP Semiconductors

CBTL04082BBS by NXP Semiconductors

CBTL04082BBS from NXP Semiconductors is a versatile multiplexer/demultiplexer in a 42-terminal, no-lead chip carrier package. It features surface mount technology and is moisture sensitivity level 2. Ideal for compact electronic applications requiring efficient signal routing.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Anansix

USA . 633 parts In-Stock

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633

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Digiode

USA . 499 parts In-Stock

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499

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Vyrian

USA . 150 parts In-Stock

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150

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Distributors (Availability)

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Native Components

USA . 654 parts In-Stock

1+ parts

$0.655

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654

$0.655

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Northwest PG Solutions

USA . 1,027 parts In-Stock

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$0.720

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1,027

$0.720

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One Stop Electronics

USA . 1,541 parts In-Stock

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$53.000

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1,541

$53.000

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A-Z Elektronik GmbH

Germany . 5,330 parts In-Stock

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5,330

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UNI Independent Distributors

Spain . 4,512 parts In-Stock

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4,512

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Alle Elektronik GmbH

Germany . 3,553 parts In-Stock

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3,553

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Corphita

USA . 2,891 parts In-Stock

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2,891

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Kepictronics

USA . 87 parts In-Stock

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87

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Overview

Elevate your designs with the CBTL04082BBS from NXP Semiconductors, a trusted leader in innovative solutions. This versatile multiplexer offers seamless integration and reliability for various applications, ensuring optimal performance in audio, video, and data routing. With its robust build and compact design, enjoy enhanced efficiency and space-saving benefits that empower your projects to excel. Choose NXP for quality that drives success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides good durability and resistance to environmental factors, making the product reliable for various applications.

Surface Mount: YES

Surface mount technology enables the device to be easily integrated into compact designs, making it ideal for modern electronic devices.

Package Shape: RECTANGULAR

The rectangular shape optimizes space on the PCB and facilitates efficient layout, which is crucial for high-density applications.

No. of Terminals: 42

With 42 terminals, this product provides ample connection options for complex circuitry, enhancing its versatility in design.

Package Style (Meter): CHIP CARRIER

The chip carrier style ensures excellent thermal and electrical performance, making it suitable for high-speed applications.

Terminal Position: QUAD

Quad terminal positioning allows for efficient routing and connections, simplifying the design process for engineers.

Terminal Form: NO LEAD

No lead terminals reduce the risk of solder defects and improve reliability and manufacturability in PCB assembly.

Moisture Sensitivity Level (MSL): 2

With an MSL of 2, this device is designed for moderate sensitivity to moisture, making it suitable for a range of manufacturing processes.

Technical Specifications

Multiplexer & Demultiplexer CBTL04082BBS attributes and parameters. Explore more Multiplexer & Demultiplexer devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PQCC-N42

Moisture Sensitivity Level (MSL):

2

No. of Terminals:

42

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Form:

Terminal Position:

QUAD

Trade Compliance

CBTL04082BBS Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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