Loading...

CBTL02042BBQ

NXP Semiconductors

CBTL02042BBQ by NXP Semiconductors

CBTL02042BBQ by NXP Semiconductors is a versatile multiplexer/demultiplexer in a 20-terminal, no-lead chip carrier package. It features a rectangular shape and surface mount design, ideal for compact electronic applications. This component enhances signal routing efficiency in various devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,723 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,723

-

-

-

-

Digiode

USA . 1,090 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,090

-

-

-

-

Vyrian

USA . 404 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

404

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 985 parts In-Stock

1+ parts

$0.122

100+ parts

-

1k+ parts

-

10k+ parts

$0.117

985

$0.122

-

-

$0.117

Northwest PG Solutions

USA . 1,702 parts In-Stock

1+ parts

$0.134

100+ parts

-

1k+ parts

-

10k+ parts

$0.118

1,702

$0.134

-

-

$0.118

One Stop Electronics

USA . 1,334 parts In-Stock

1+ parts

$10.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,334

$10.000

-

-

-

UNI Independent Distributors

Spain . 7,181 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,181

-

-

-

-

Corphita

USA . 3,738 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,738

-

-

-

-

Overview

Unlock superior performance with the CBTL02042BBQ from NXP Semiconductors, a leader in innovative solutions. This high-quality multiplexer offers unparalleled efficiency and reliability for your applications, ensuring seamless data management in compact designs. Experience the advantage of NXP's commitment to excellence, providing durable, space-saving components that enhance system functionality while maximizing value. Elevate your projects with this exceptional product today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body offers excellent durability and resistance to environmental conditions, making this product suitable for various applications.

Surface Mount: YES

Being surface mount compatible allows for easier integration into compact circuit designs and improves the overall space efficiency of the PCB.

Package Shape: RECTANGULAR

The rectangular shape optimizes space utilization on printed circuit boards, enabling more efficient layout designs.

No. of Terminals: 20

With 20 terminals, this multiplexer/demultiplexer can handle a significant number of signals, making it versatile for complex circuits.

Package Style (Meter): CHIP CARRIER

The chip carrier package style ensures easy handling and mounting, providing reliability in automotive and consumer electronics applications.

Terminal Position: QUAD

Quad terminal positioning allows for improved signal integrity and reduced crosstalk, essential for maintaining performance in high-frequency applications.

Terminal Form: NO LEAD

No lead design helps in reducing the overall footprint, which is essential for modern compact devices while also offering lead-free options for environmentally-friendly manufacturing.

Technical Specifications

Multiplexer & Demultiplexer CBTL02042BBQ attributes and parameters. Explore more Multiplexer & Demultiplexer devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PQCC-N20

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

20

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Form:

Terminal Position:

QUAD

Trade Compliance

CBTL02042BBQ Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 19